SLVSDC7F April   2017  – February 2022 DRV5032

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Magnetic Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Magnetic Flux Direction
      2. 8.3.2 Device Version Comparison
        1. 8.3.2.1 Magnetic Threshold
        2. 8.3.2.2 Magnetic Response
        3. 8.3.2.3 Output Type
        4. 8.3.2.4 Sampling Rate
      3. 8.3.3 Hall Element Location
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Output Type Tradeoffs
    2. 9.2 Typical Applications
      1. 9.2.1 General-Purpose Magnet Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Three-Position Switch
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
    3. 9.3 Do's and Don'ts
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBZ|3
  • DMR|4
  • LPG|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

GUID-7CE76C81-8ED0-496F-AEDA-8B2AFEB39C1E-low.gifFigure 6-1 FA, FB, FC, AJ, ZE Versions DBZ Package3-Pin SOT-23Top View
GUID-A990DCF7-E6EB-441B-9FCB-0DD3BA5DBE72-low.gifFigure 6-3 FA, AJ Versions DMR Package4-Pin X2SONTop View
GUID-DD404A4E-6A32-471E-9599-931BA1EF88AE-low.gifFigure 6-5 FA, FB, FC, AJ, ZE Versions LPG Package3-Pin TO-92Top View
GUID-BDB2297B-3505-4FCD-809B-BAD8323E504E-low.gifFigure 6-2 DU Version DBZ Package3-Pin SOT-23Top View
GUID-1202FEC3-A5DF-4E70-A7F6-2258BCABD38E-low.gifFigure 6-4 DU, FD Versions DMR Package4-Pin X2SONTop View
GUID-A8E4747B-B4D5-44A2-87BF-25BB01D4EF36-low.gifFigure 6-6 DU, FD Versions LPG Package3-Pin TO-92Top View
Table 6-1 Pin Functions
PIN I/O DESCRIPTION
NAME SOT-23
(FA, FB, FC, AJ, ZE)		 SOT-23
(DU)		 TO-92
(FA, FB, FC, AJ, ZE)		 TO-92
(DU, FD)		 X2SON
(FA, AJ)		 X2SON
(DU, FD)
GND 3 3 2 2 2 2 — Ground reference
OUT 2 — 3 — 4 — O Omnipolar output that responds to north and south magnetic poles
OUT1 — — — — — 4 O Unipolar output that responds to north magnetic poles near the top of the package
OUT2 — 2 — 3 — 3 O Unipolar output that responds to south magnetic poles near the top of the package
NC — — — — 3 — — No-connect. This pin is not connected to the silicon. It should be left floating or tied to ground. It should be soldered to the board for mechanical support.
VCC 1 1 1 1 1 1 — 1.65-V to 5.5-V power supply. TI recommends connecting this pin to a ceramic capacitor to ground with a value of at least 0.1 µF.
Thermal Pad — — — — PAD PAD — No-connect. This pin should be left floating or tied to ground. It should be soldered to the board for mechanical support.