SLVSDC7H April   2017  – December 2024 DRV5032

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Magnetic Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Magnetic Flux Direction
      2. 7.3.2 Device Version Comparison
        1. 7.3.2.1 Magnetic Threshold
        2. 7.3.2.2 Magnetic Response
        3. 7.3.2.3 Output Type
        4. 7.3.2.4 Sampling Rate
      3. 7.3.3 Hall Element Location
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Type Tradeoffs
    2. 8.2 Typical Applications
      1. 8.2.1 General-Purpose Magnet Sensing
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Three-Position Switch
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBZ|3
  • DMR|4
  • LPG|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DRV5032 FA, FB, FC, AJ, ZE Versions DBZ Package3-Pin SOT-23Top ViewFigure 5-1 FA, FB, FC, AJ, ZE Versions DBZ Package3-Pin SOT-23Top View
DRV5032 FA, FB, AJ Versions DMR Package4-Pin X2SONTop ViewFigure 5-3 FA, FB, AJ Versions DMR Package4-Pin X2SONTop View
DRV5032 FA, FB, FC, AJ, ZE Versions LPG Package3-Pin TO-92Top ViewFigure 5-5 FA, FB, FC, AJ, ZE Versions LPG Package3-Pin TO-92Top View
DRV5032 DU Version DBZ Package3-Pin SOT-23Top ViewFigure 5-2 DU Version DBZ Package3-Pin SOT-23Top View
DRV5032 DU, DG, FD Versions DMR Package4-Pin X2SONTop ViewFigure 5-4 DU, DG, FD Versions DMR Package4-Pin X2SONTop View
DRV5032 DU, FD Versions LPG Package3-Pin TO-92Top ViewFigure 5-6 DU, FD Versions LPG Package3-Pin TO-92Top View
Table 5-1 Pin Functions
PIN I/O DESCRIPTION
NAME SOT-23
(FA, FB, FC, AJ, ZE)		 SOT-23
(DU)		 TO-92
(FA, FB, FC, AJ, ZE)		 TO-92
(DU, FD)		 X2SON
(FA, FB, AJ)		 X2SON
(DU, DG, FD)
GND 3 3 2 2 2 2 — Ground reference
OUT 2 — 3 — 4 — O Omnipolar output that responds to north and south magnetic poles
OUT1 — — — — — 4 O Unipolar output that responds to north magnetic poles near the top of the package
OUT2 — 2 — 3 — 3 O Unipolar output that responds to south magnetic poles near the top of the package
NC — — — — 3 — — No-connect. This pin is not connected to the silicon. Leave this pin floating or tied to ground. Solder the pin to the board for mechanical support.
VCC 1 1 1 1 1 1 — 1.65-V to 5.5-V power supply. TI recommends connecting this pin to a ceramic capacitor to ground with a value of at least 0.1 µF.
Thermal Pad — — — — PAD PAD — No-connect. Leave this pin floating or tied to ground. Solder the pin to the board for mechanical support.