SLVSFN2 September   2021 DRV8311

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 SPI Secondary Mode Timings
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Output Stage
      2. 7.3.2  Control Modes
        1. 7.3.2.1 6x PWM Mode (DRV8311S and DRV8311H variants only)
        2. 7.3.2.2 3x PWM Mode (DRV8311S and DRV8311H variants only)
        3. 7.3.2.3 PWM Generation Mode (DRV8311S and DRV8311P Variants)
      3. 7.3.3  Device Interface Modes
        1. 7.3.3.1 Serial Peripheral Interface (SPI)
        2. 7.3.3.2 Hardware Interface
      4. 7.3.4  AVDD Linear Voltage Regulator
      5. 7.3.5  Charge Pump
      6. 7.3.6  Slew Rate Control
      7. 7.3.7  Cross Conduction (Dead Time)
      8. 7.3.8  Propagation Delay
      9. 7.3.9  Pin Diagrams
        1. 7.3.9.1 Logic Level Input Pin (Internal Pulldown)
        2. 7.3.9.2 Logic Level Input Pin (Internal Pullup)
        3. 7.3.9.3 Open Drain Pin
        4. 7.3.9.4 Push Pull Pin
        5. 7.3.9.5 Four Level Input Pin
      10. 7.3.10 Current Sense Amplifiers
        1. 7.3.10.1 Current Sense Amplifier Operation
        2. 7.3.10.2 Current Sense Amplifier Offset Correction
      11. 7.3.11 Protections
        1. 7.3.11.1 VM Supply Undervoltage Lockout (NPOR)
        2. 7.3.11.2 Under Voltage Protections (UVP)
        3. 7.3.11.3 Overcurrent Protection (OCP)
          1. 7.3.11.3.1 OCP Latched Shutdown (OCP_MODE = 010b)
          2. 7.3.11.3.2 OCP Automatic Retry (OCP_MODE = 000b or 001b)
          3. 7.3.11.3.3 OCP Report Only (OCP_MODE = 011b)
          4. 7.3.11.3.4 OCP Disabled (OCP_MODE = 111b)
        4. 7.3.11.4 Thermal Protections
          1. 7.3.11.4.1 Thermal Warning (OTW)
          2. 7.3.11.4.2 Thermal Shutdown (OTSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Functional Modes
        1. 7.4.1.1 Sleep Mode
        2. 7.4.1.2 Operating Mode
        3. 7.4.1.3 Fault Reset (CLR_FLT or nSLEEP Reset Pulse)
    5. 7.5 SPI Communication
      1. 7.5.1 Programming
        1. 7.5.1.1 SPI and tSPI Format
  8. DRV8311 Registers
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Three-Phase Brushless-DC Motor Control
        1. 9.2.1.1 Detailed Design Procedure
          1. 9.2.1.1.1 Motor Voltage
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
      1. 11.3.1 Power Dissipation
  12. 12Device and Documentation Support
    1. 12.1 Support Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • RRW|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Three-phase PWM motor driver
    • 3-Phase brushless DC motors
  • 3-V to 20-V operating voltage
    • 24-V Absolute maximum voltage
  • High output current capability
    • 5-A Peak current drive
  • Low on-state resistance MOSFETs
    • 200-mΩ typ RDS(ON) (HS + LS) at TA = 25°C
  • Low power sleep mode
    • 1.5-µA at VVM = 12-V, TA = 25°C
  • Multiple control interface options
    • 6x PWM control interface
    • 3x PWM control interface
    • PWM generation mode (SPI/tSPI) with optional calibration between MCU and DRV8311
  • tSPI interface (DRV8311P)
    • PWM duty and frequency update over SPI
    • Control multiple DRV8311P devices using standard 4-wire SPI interface
  • Supports up to 200-kHz PWM frequency
  • Integrated current sensing
    • No external resistor required
    • Sense amplifier output, one per 1/2-H
  • SPI and hardware device variants
    • 10-MHz SPI communication (SPI/tSPI)
  • Supports 1.8-V, 3.3-V, and 5-V logic inputs
  • Built-in 3.3-V ± 4.5%, 100-mA LDO regulator
  • Integrated protection features
    • VM undervoltage lockout (UVLO)
    • Charge pump undervoltage (CPUV)
    • Overcurrent protection (OCP)
    • Thermal warning and shutdown (OTW/OTSD)
    • Fault condition indication pin (nFAULT)