SLVSD29 October   2015 DRV8704

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PWM Motor Drivers
      2. 7.3.2  Direct PWM Input Mode (Dual Brushed DC Gate Driver)
      3. 7.3.3  Current Regulation
      4. 7.3.4  Decay Modes
      5. 7.3.5  Blanking Time
      6. 7.3.6  Gate Drivers
      7. 7.3.7  Configuring Gate Drivers
      8. 7.3.8  External FET Selection
      9. 7.3.9  Protection Circuits
        1. 7.3.9.1 Overcurrent Protection (OCP)
        2. 7.3.9.2 Gate Driver Fault (PDF)
        3. 7.3.9.3 Thermal Shutdown (TSD)
        4. 7.3.9.4 Undervoltage Lockout (UVLO)
      10. 7.3.10 Serial Data Format
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
      1. 7.5.1 Control Registers
        1. 7.5.1.1 CTRL Register (Address = 0x00h)
          1. Table 4. CTRL Register
        2. 7.5.1.2 TORQUE Register (Address = 0x01h)
          1. Table 5. TORQUE Register
        3. 7.5.1.3 OFF Register (Address = 0x02h)
          1. Table 6. OFF Register
        4. 7.5.1.4 BLANK Register (Address = 0x03h)
          1. Table 7. BLANK Register
        5. 7.5.1.5 DECAY Register (Address = 0x04h)
          1. Table 8. DECAY Register
        6. 7.5.1.6 Reserved Register Address = 0x05h
          1. Table 9. Reserved Register
        7. 7.5.1.7 DRIVE Register Address = 0x06h
          1. Table 10. DRIVE Register
        8. 7.5.1.8 STATUS Register (Address = 0x07h)
          1. Table 11. STATUS Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External FET Selection
        2. 8.2.2.2 IDRIVE Configuration
        3. 8.2.2.3 Current Chopping Configuration
        4. 8.2.2.4 Decay Modes
        5. 8.2.2.5 Sense Resistor
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range referenced with respect to GND (unless otherwise noted) (1)
MIN MAX UNIT
Power supply voltage (VM) –0.6 60 V
Charge pump voltage (CP1, CP2, VCP) –0.6 VM + 12 V
5-V regulator voltage (V5) –0.6 5.5 V
Internal regulator voltage (VINT) –0.6 2.0 V
Digital pin voltage (SLEEPn, RESET, AIN1, AIN2, BIN1, BIN2, SCS, SCLK, SDATI, SDATO, FAULTn) –0.6 5.5 V
High-side gate drive pin voltage (A1HS, A2HS, B1HS, B2HS) –0.6 VM + 12 V
Low-side gate drive pin voltage (A1LS, A2LS, B1LS, B2LS) –0.6 12 V
Phase node pin voltage (AOUT1, AOUT2, BOUT1, BOUT2) –0.6 VM V
ISENSEx pin voltage (AISENP, AISENN, BISENP, BISENN) –0.7 +0.7 V
Operating virtual junction temperature, TJ –40 150 °C
Storage temperature, Tstg –60 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.