SLVSD29 October   2015 DRV8704

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PWM Motor Drivers
      2. 7.3.2  Direct PWM Input Mode (Dual Brushed DC Gate Driver)
      3. 7.3.3  Current Regulation
      4. 7.3.4  Decay Modes
      5. 7.3.5  Blanking Time
      6. 7.3.6  Gate Drivers
      7. 7.3.7  Configuring Gate Drivers
      8. 7.3.8  External FET Selection
      9. 7.3.9  Protection Circuits
        1. 7.3.9.1 Overcurrent Protection (OCP)
        2. 7.3.9.2 Gate Driver Fault (PDF)
        3. 7.3.9.3 Thermal Shutdown (TSD)
        4. 7.3.9.4 Undervoltage Lockout (UVLO)
      10. 7.3.10 Serial Data Format
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
      1. 7.5.1 Control Registers
        1. 7.5.1.1 CTRL Register (Address = 0x00h)
          1. Table 4. CTRL Register
        2. 7.5.1.2 TORQUE Register (Address = 0x01h)
          1. Table 5. TORQUE Register
        3. 7.5.1.3 OFF Register (Address = 0x02h)
          1. Table 6. OFF Register
        4. 7.5.1.4 BLANK Register (Address = 0x03h)
          1. Table 7. BLANK Register
        5. 7.5.1.5 DECAY Register (Address = 0x04h)
          1. Table 8. DECAY Register
        6. 7.5.1.6 Reserved Register Address = 0x05h
          1. Table 9. Reserved Register
        7. 7.5.1.7 DRIVE Register Address = 0x06h
          1. Table 10. DRIVE Register
        8. 7.5.1.8 STATUS Register (Address = 0x07h)
          1. Table 11. STATUS Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External FET Selection
        2. 8.2.2.2 IDRIVE Configuration
        3. 8.2.2.3 Current Chopping Configuration
        4. 8.2.2.4 Decay Modes
        5. 8.2.2.5 Sense Resistor
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1 Design Requirements

Table 12 shows design input parameters for system design.

Table 12. Design Parameters

DESIGN PARAMETER REFERENCE EXAMPLE VALUE
Supply voltage VM 24 V
FET total gate charge (1) Qg 41 nC (typically)
FET gate-to-drain charge (1) Qgd 6.7 nC (typically)
Target FET gate rise time RT 20 to 100 ns
Motor winding resistance RL 400 mΩ
Motor winding inductance LL 258 μH
Target chopping current ICHOP 5.5 A
(1) FET part number is CSD18540Q5B