SLVS857B December   2009  – January 2015 DRV8808

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Setup Mode, Extended Setup Mode, Power-Down Mode
        1. 7.3.1.1 Operation Setup Register Bit Assignment
        2. 7.3.1.2 Operation Extended Setup Register Bit Assignment
        3. 7.3.1.3 Deep Sleep Mode
        4. 7.3.1.4 DC Motor Drive
        5. 7.3.1.5 Short/Open for Motor Outputs
        6. 7.3.1.6 Charge Pump
        7. 7.3.1.7 DC-DC Converters
        8. 7.3.1.8 nReset: Input for System Reset
        9. 7.3.1.9 VM Start-up/Power-Down and Glitch Condition
      2. 7.3.2 Blanking Time Insertion Timing for DC Motor Driving
      3. 7.3.3 Function Table in nORT, Power Down, VM Conditions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With 7 V < VM < 18 V
      2. 7.4.2 Operation With 18 V ≤ VM ≤ 38 V
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Voltage for Each DC-DC Converter
        2. 8.2.2.2 Output Voltage Start Up Sequence
        3. 8.2.2.3 Other Parameters
        4. 8.2.2.4 Motor Configuration
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

  • Recommended to have GND plane layer for better thermal performance. Thermal pad directly going down to GND layer just under the device is the best way.
  • Distance between Odx to Inductance should be as close as possible. This line has switching from 0 V to VM.
  • FBx pin and external feedback resistor should be as close as possible. This is the analog sensing pin for the DC-DC converter.
  • V3p3 pin is for internal analog reference voltage, and should be quiet. External 0.1 µF should be located closer.

10.2 Layout Example

layout_slvs857.gifFigure 30. Layout Schematic