SLVS865J September   2008  – April 2017 DRV8811

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM H-Bridge Drivers
      2. 7.3.2 Current Regulation
      3. 7.3.3 Decay Mode
      4. 7.3.4 Microstepping Indexer
      5. 7.3.5 Protection Circuits
        1. 7.3.5.1 Overcurrent Protection (OCP)
        2. 7.3.5.2 Thermal Shutdown (TSD)
        3. 7.3.5.3 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 RESETn, ENABLEn and SLEEPn Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Information
      1. 10.3.1 Heatsinking
    4. 10.4 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

PWP PowerPAD™ Package
28-Pin HTSSOP With Exposed Thermal Pad
Top View

Pin Functions

PIN TYPE(1) DESCRIPTION
NAME NO.
AOUT1 4 O Bridge A output 1. Connect to bipolar stepper motor winding A
AOUT2 25 O Bridge A output 2. Positive current is AOUT1 → AOUT2
BOUT1 11 O Bridge B output 1. Connect to bipolar stepper motor winding B
BOUT2 18 O Bridge B output 2. Positive current is BOUT1 → BOUT2
CP1 23 PWR Charge pump flying capacitor. Connect a 0.22-μF capacitor between CP1 and CP2
CP2 24 PWR Charge pump flying capacitor. Connect a 0.22-μF capacitor between CP1 and CP2
DECAY 5 I Decay mode select. Voltage applied sets decay mode - see motor driver description for details. Bypass to GND with a 0.1-μF ceramic capacitor
DIR 3 I Direction input. Level sets the direction of stepping
ENABLEn 26 I Enable input. Logic high to disable device outputs, logic low to enable outputs
GND 7, 21 — Device ground
HOMEn 2 O Home position. Logic low when at home state of step table, logic high at other states
ISENA 1 I Bridge A ground / ISENSE. Connect to current sense resistor for bridge A
ISENB 14 I Bridge B ground / ISENSE. Connect to current sense resistor for bridge B
RCA 6 I Bridge A blanking and off time adjust. Connect a parallel resistor and capacitor to GND - see motor driver description for details
RCB 9 I Bridge B blanking and off time adjust. Connect a parallel resistor and capacitor to GND - see motor driver description for details
RESETn 17 I Reset input. Active-low reset input initializes the indexer logic and disables the H-bridge outputs
SLEEPn 27 I Sleep mode input. Logic high to enable device, logic low to enter low-power sleep mode
SRn 16 I Synchronous rectification enable input. Active-low. When low, synchronous rectification is enabled. Weak internal pulldown.
STEP 19 I Step input. Rising edge causes the indexer to move one step
USM0 13 I Microstep mode 0. USM0 and USM1 set the step mode - full step, half step, quarter step, or eight microsteps/step
USM1 12 I Microstep mode 1. USM0 and USM1 set the step mode - full step, half step, quarter step, or eight microsteps/step
VCC 10 PWR Logic supply voltage. Connect to 3-V to 5-V logic supply. Bypass to GND with a 0.1-μF ceramic capacitor
VCP 22 PWR High-side gate drive voltage. Connect a 0.22-μF ceramic capacitor to VM
VGD 20 PWR Low-side gate drive voltage. Bypass to GND with a 0.22-μF ceramic capacitor
VMA 28 PWR Bridge A power supply. Connect to motor supply (8 V to 38 V). Both VMA and VMB must be connected to same supply.
VMB 15 PWR Bridge B power supply. Connect to motor supply (8 V to 38 V). Both VMA and VMB must be connected to same supply.
VREF 8 I Current set reference input. Reference voltage for winding current set
Thermal pad — — Thermal pad. Connect to system ground with large copper plane for improved thermal dissipation.
(1) Directions: I = input, O = output, I/O = input/output, PWR = power