SNLS324F April   2011  – August 2021 DS80PCI402

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings (1) (1) (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Ratings
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics — Serial Management Bus Interface
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 15
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 4-Level Input Configuration Guidelines
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Control Mode
      2. 8.4.2 SMBUS Mode
    5. 8.5 Programming
      1. 8.5.1 System Management Bus (SMBus) and Configuration Registers
      2. 8.5.2 Transfer of Data Through the SMBus
      3. 8.5.3 Writing a Register
      4. 8.5.4 Reading a Register
      5. 8.5.5 SMBus Controller Mode
    6. 8.6 Register Maps
      1.      31
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 3.3-V or 2.5-V Supply Mode Operation
    2. 10.2 Power Supply Bypassing
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Layout Considerations for Differential Pairs
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.