SNLS420D July   2012  – July 2015 DS90UB913Q-Q1 , DS90UB914Q-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description continued
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics
    6. 8.6  Timing Requirements: Recommended for Serializer PCLK
    7. 8.7  AC Timing Specifications (SCL, SDA) - I2C Compliant
    8. 8.8  Bidirectional Control Bus DC Timing Specifications (SCL, SDA) - I2C Compliant
    9. 8.9  Switching Characteristics: Serializer
    10. 8.10 Switching Characteristics: Deserializer
    11. 8.11 Typical Characteristics
  9. Parameter Measurement Information
    1. 9.1 AC Timing Diagrams and Test Circuits
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Serial Frame Format
      2. 10.3.2  Line Rate Calculations for the DS90UB91xQ
      3. 10.3.3  Deserializer Multiplexer Input
      4. 10.3.4  Error Detection
      5. 10.3.5  Description of Bidirectional Control Bus and I2C Modes
      6. 10.3.6  Slave Clock Stretching
      7. 10.3.7  I2C Pass-Through
      8. 10.3.8  ID[x] Address Decoder on the Serializer
      9. 10.3.9  ID[x] Address Decoder on the Deserializer
      10. 10.3.10 Programmable Controller
      11. 10.3.11 Synchronizing Multiple Cameras
      12. 10.3.12 General-Purpose I/O (GPIO) Descriptions
      13. 10.3.13 LVCMOS VDDIO Option
      14. 10.3.14 Deserializer - Adaptive Input Equalization (AEQ)
      15. 10.3.15 EMI Reduction
        1. 10.3.15.1 Deserializer Staggered Output
        2. 10.3.15.2 Spread Spectrum Clock Generation (SSCG) on the Deserializer
    4. 10.4 Device Functional Modes
      1. 10.4.1  DS90UB91xQ-Q1 Operation With External Oscillator as Reference Clock
      2. 10.4.2  DS90UB91xQ-Q1 Operation With Pixel Clock from Imager as Reference Clock
      3. 10.4.3  MODE Pin on Serializer
      4. 10.4.4  MODE Pin on Deserializer
      5. 10.4.5  Clock-Data Recovery Status Flag (LOCK), Output Enable (OEN) and Output State Select (OSS_SEL)
      6. 10.4.6  Multiple Device Addressing
      7. 10.4.7  Powerdown
      8. 10.4.8  Pixel Clock Edge Select (TRFB / RRFB)
      9. 10.4.9  Power-Up Requirements and PDB Pin
      10. 10.4.10 Built-In Self Test
      11. 10.4.11 BIST Configuration and Status
        1. 10.4.11.1 Sample BIST Sequence
    5. 10.5 Register Maps
  11. 11Application and Implementation
    1. 11.1 Applications Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 Transmission Media
        2. 11.2.1.2 Adaptive Equalizer - Loss Compensation
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curve
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Related Links
    3. 14.3 Community Resources
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHS|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

15 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.