11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
AN-2198 Exploring the Internal Test Pattern Generation Feature of 720p, SNLA132
I2C Communication Over FPD-Link III with Bidirectional Control Channel, SNLA131
AN-1187 Leadless Leadframe Package (LLP), SNOA401
AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines, SNLA008
AN-905 Transmission Line RAPIDESIGNER Operation and Applications Guide, SNLA035
LVDS Owner’s Manual, SNLA187
QFN/SON PCB Attachment, SLUA271
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11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.