SNLS416D June   2012  – January 2015 DS90UB927Q-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics
    6. 6.6  AC Electrical Characteristics
    7. 6.7  Electrical Characteristics: DC and AC Serial Control Bus
    8. 6.8  Timing Requirements for the Serial Control Bus
    9. 6.9  Timing Requirements - DC and AC Serial Control Bus Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High-Speed Forward Channel Data Transfer
      2. 7.3.2  Low-Speed Back Channel Data Transfer
      3. 7.3.3  Common Mode Filter Pin (CMF)
      4. 7.3.4  Video Control Signals
      5. 7.3.5  EMI Reduction Features
        1. 7.3.5.1 LVCMOS VDDIO Option
      6. 7.3.6  Built-In Self Test (BIST)
        1. 7.3.6.1 BIST Configuration and Status
        2. 7.3.6.2 Sample BIST Sequence
      7. 7.3.7  Forward Channel and Back Channel Error Checking
      8. 7.3.8  Internal Pattern Generation
        1. 7.3.8.1 Pattern Options
        2. 7.3.8.2 Color Modes
        3. 7.3.8.3 Video Timing Modes
        4. 7.3.8.4 External Timing
        5. 7.3.8.5 Pattern Inversion
        6. 7.3.8.6 Auto Scrolling
      9. 7.3.9  Remote Auto Power-Down Mode
      10. 7.3.10 Input RxCLKIN Loss Detect
      11. 7.3.11 Serial Link Fault Detect
      12. 7.3.12 Interrupt Pin (INTB)
      13. 7.3.13 General-Purpose I/O
        1. 7.3.13.1 GPIO[3:0]
        2. 7.3.13.2 GPIO[8:5]
      14. 7.3.14 I2S Audio Interface
        1. 7.3.14.1 I2S Transport Modes
        2. 7.3.14.2 I2S Repeater
      15. 7.3.15 Additional Features
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down (PDB)
      2. 7.4.2 Backward Compatible Mode
      3. 7.4.3 Low Frequency Optimization (LFMODE)
      4. 7.4.4 FPD-Link Input Frame and Color Bit Mapping Select
      5. 7.4.5 Repeater
        1. 7.4.5.1 Repeater Configuration
        2. 7.4.5.2 Repeater Connections
          1. 7.4.5.2.1 Repeater Fan-Out Electrical Requirements
    5. 7.5 Programming
      1. 7.5.1 Serial Control Bus
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 CML Interconnect Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RTA|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

RTA Package
40-Pin WQFN With Exposed Thermal Pad
Top View
UB927_Pinout.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
FPD-LINK INPUT INTERFACE
RxCLKIN- 35 I, LVDS Inverting LVDS Clock Input
The pair requires external 100-Ω differential termination for standard LVDS levels
RxCLKIN+ 36 I, LVDS True LVDS Clock Input
The pair requires external 100-Ω differential termination for standard LVDS levels
RxIN[3:0]- 37, 33,
31, 29		 I, LVDS Inverting LVDS Data Inputs
Each pair requires external 100-Ω differential termination for standard LVDS levels
RxIN[3:0]+ 38, 34,
32, 30		 I, LVDS True LVDS Data Inputs
Each pair requires external 100-Ω differential termination for standard LVDS levels
LVCMOS PARALLEL INTERFACE
BKWD 22 I, LVCMOS
with pulldown		 Backward Compatible Mode Select
BKWD = 0, interfacing to DS90UH926/8Q-Q1 (Default)
BKWD = 1, interfacing to DS90UR906/8Q-Q1, DS90UR916Q
Requires a 10-kΩ pullup if set HIGH
GPIO[1:0] 40, 39 I/O, LVCMOS
with pulldown		 General Purpose I/O
See Table 1
I2S_DA
I2S_DB
I2S_DC
I2S_DD		 3
4
5
6		 I, LVCMOS
with pulldown		 Digital Audio Interface I2S Data Inputs
Shared with GPIO_REG6, GPIO_REG5, GPIO2, GPIO3
I2S_WC
I2S_CLK		 1
2		 I, LVCMOS
with pulldown 		Digital Audio Interface I2S Word Clock and I2S Bit Clock Inputs
Shared with GPIO_REG7 and GPIO_REG8 (Table 3)
LFMODE 25 I, LVCMOS
with pulldown		 Low Frequency Mode Select
LFMODE = 0, 15 MHz ≤ RxCLKIN ≤ 85 MHz (Default)
LFMODE = 1, 5 MHz ≤ RxCLKIN < 15 MHz
Requires a 10-kΩ pullup if set HIGH
MAPSEL 23 I, LVCMOS
with pulldown		 FPD-Link Input Map Select
MAPSEL = 0, LSBs on RxIN3± (Default)
MAPSEL = 1, MSBs on RxIN3±

See Figure 19 and Figure 20
Requires a 10-kΩ pullup if set HIGH
REPEAT 21 I, LVCMOS
with pulldown		 Repeater Mode Select
REPEAT = 0, Repeater Mode disabled (Default)
REPEAT = 1, Repeater Mode enabled
Requires a 10-kΩ pullup if set HIGH
OPTIONAL PARALLEL INTERFACE
GPIO[3:2] 6, 5 I/O, LVCMOS
with pulldown		 General Purpose I/O
Shared with I2S_DD and I2S_DC (See Table 1)
GPIO_REG
[8:5]		 2, 1, 3, 4 I/O, LVCMOS
with pulldown		 Register-Only General Purpose I/O
Shared with I2S_CLK, I2S_WC, I2S_DA, I2S_DB (See Table 2)
CONTROL AND CONFIGURATION
IDx 11 I, Analog I2C Address Select
External pullup to VDD33 is required under all conditions. DO NOT FLOAT.
Connect to external pullup to VDD33 and pulldown to GND to create a voltage divider.
See Figure 25 and Table 4
PDB 18 I, LVCMOS
with pulldown		 Power-down Mode Input Pin
Must be driven or pulled up to VDD33. Refer to Power Supply Recommendations.
PDB = H, device is enabled (normal operation)
PDB = L, device is powered down.
When the device is in the powered down state, the Driver Outputs are both HIGH, the PLL is shutdown, and IDD is minimized. Control Registers are RESET.
SCL 9 I/O, LVCMOS
Open Drain		 I2C Clock Input / Output Interface
Must have an external pullup to VDD33. DO NOT FLOAT.
Recommended pullup: 4.7 kΩ.
SDA 10 I/O, LVCMOS
Open Drain		 I2C Data Input / Output Interface
Must have an external pullup to VDD33. DO NOT FLOAT.
Recommended pullup: 4.7 kΩ.
STATUS
INTB 27 O, LVCMOS
Open Drain		 Interrupt
INTB = H, normal
INTB = L, Interrupt request
Recommended pullup: 4.7 kΩ to VDDIO. DO NOT FLOAT.
FPD-LINK III SERIAL INTERFACE
CMF 20 Analog Common Mode Filter.
Connect 0.1 µF to GND (required)
DOUT- 16 I/O, LVDS Inverting Output
The output must be AC-coupled with a 0.1-µF capacitor.
DOUT+ 17 I/O, LVDS True Output
The output must be AC-coupled with a 0.1-µF capacitor.
POWER(1) AND GROUND
GND DAP Ground Large metal contact at the bottom center of the device package Connect to the ground plane (GND) with at least 9 vias.
VDD33_A
VDD33_B		 19
26		 Power Power to on-chip regulator 3.0 V - 3.6 V. Each pin requires a 4.7-µF capacitor to GND
VDDIO 7, 24 Power LVCMOS I/O Power 1.8 V ±5% OR 3.0 V - 3.6 V. Each pin requires 4.7-µF capacitor to GND
REGULATOR CAPACITOR
CAPL12 8 CAP Decoupling capacitor connection for on-chip regulator
Requires two 4.7-µF decoupling capacitors to GND
CAPP12
CAPHS12
CAPLVD12		 12
14
28		 CAP Decoupling capacitor connection for on-chip regulator
Each requires a 4.7-µF decoupling capacitor to GND.
OTHER
RES[1:0] 15, 13 GND Reserved
Connect to GND.
(1) The VDD (VDD33 and VDDIO) supply ramp should be faster than 1.5 ms with a monotonic rise.