SNOSB66B August   2011  – November 2014 EMB1412

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
  8. 8 Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Thermal Performance
  9. 9 Device and Documentation Support
    1. 9.1 Trademarks
    2. 9.2 Electrostatic Discharge Caution
    3. 9.3 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

VSSOP (DGN)
8 Pins
Top View
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Pin Functions

PIN NAME DESCRIPTION APPLICATION INFORMATION
1 IN_REF Ground reference for control inputs Connect to power ground (VEE) for standard positive only output voltage swing. Connect to system logic ground when VEE is connected to a negative gate drive supply.
2 INB Inverting input pin TTL compatible thresholds. Connect to IN_REF when not used.
3 VEE Power ground for driver outputs Connect to either power ground or a negative gate drive supply for positive or negative voltage swing.
4 IN Non-inverting input pin TTL compatible thresholds. Pull up to VCC when not used.
5, 8 N/C Not internally connected
6 VCC Positive Supply voltage input Locally decouple to VEE. The decoupling capacitor should be located close to the chip.
7 OUT Gate drive output Capable of sourcing 3 A and sinking 7 A. Voltage swing of this output is from VEE to VCC.
- - - Exposed Pad Exposed Pad, underside of package Internally bonded to the die substrate. Connect to VEE ground pin for low thermal impedance.