SBOS378 March   2019 INA185

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 High Bandwidth and Slew Rate
      2. 7.3.2 Bidirectional Current Monitoring
      3. 7.3.3 Wide Input Common-Mode Voltage Range
      4. 7.3.4 Precise Low-Side Current Sensing
      5. 7.3.5 Rail-to-Rail Output Swing
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Unidirectional Mode
      3. 7.4.3 Bidirectional Mode
      4. 7.4.4 Input Differential Overload
      5. 7.4.5 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Connections
      2. 8.1.2 RSENSE and Device Gain Selection
      3. 8.1.3 Signal Filtering
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 Common-Mode Transients Greater Than 26 V
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • SOT-563 package (1.6 mm × 1.6 mm)
    • 39% smaller footprint than SC70
    • 0.55 mm package height
  • Common-mode range (VCM): –0.2 V to +26 V
  • High bandwidth: 350 kHz (A1 devices)
  • Offset voltage:
    • ±55 µV (max) at VCM = 0 V
    • ±100 µV (max) at VCM = 12 V (A4 device)
  • Output slew rate: 2 V/µs
  • Bidirectional current-sensing capability
  • Accuracy:
    • ±0.2% maximum gain error (A1, A2, A3)
    • 0.5-µV/°C maximum offset drift
  • Gain options:
    • 20 V/V (A1 devices)
    • 50 V/V (A2 devices)
    • 100 V/V (A3 devices)
    • 200 V/V (A4 devices)
  • Quiescent current: 260 µA (max)