SBOS386B May   2019  – March 2022 INA186-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Precision Current Measurement
      2. 7.3.2 Low Input Bias Current
      3. 7.3.3 Low Quiescent Current With Output Enable
      4. 7.3.4 Bidirectional Current Monitoring
      5. 7.3.5 High-Side and Low-Side Current Sensing
      6. 7.3.6 High Common-Mode Rejection
      7. 7.3.7 Rail-to-Rail Output Swing
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Unidirectional Mode
      3. 7.4.3 Bidirectional Mode
      4. 7.4.4 Input Differential Overload
      5. 7.4.5 Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Connections
      2. 8.1.2 RSENSE and Device Gain Selection
      3. 8.1.3 Signal Conditioning
      4. 8.1.4 Common-Mode Voltage Transients
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) INA186-Q1 UNIT
DBV (SOT23) DCK (SC70) DDF (SOT23)
5 PINS 6 PINS 8 PINS
RqJA Junction-to-ambient thermal resistance 176.3 170.7 164.6 °C/W
RqJC(top) Junction-to-case (top) thermal resistance 105.6 132.7 86.6 °C/W
RqJB Junction-to-board thermal resistance 66.4 65.3 84.3 °C/W
YJT Junction-to-top characterization parameter 43.9 45.7 7.1 °C/W
YJB Junction-to-board characterization parameter 66.1 65.2 83.8 °C/W
RqJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.