SBOS448G August   2008  – December 2015 INA219

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Related Products
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics:
    6. 7.6 Bus Timing Diagram Definitions
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Basic ADC Functions
        1. 8.3.1.1 Power Measurement
        2. 8.3.1.2 PGA Function
        3. 8.3.1.3 Compatibility With TI Hot Swap Controllers
    4. 8.4 Device Functional Modes
      1. 8.4.1 Filtering and Input Considerations
    5. 8.5 Programming
      1. 8.5.1 Programming the Calibration Register
      2. 8.5.2 Programming the Power Measurement Engine
        1. 8.5.2.1 Calibration Register and Scaling
      3. 8.5.3 Simple Current Shunt Monitor Usage (No Programming Necessary)
      4. 8.5.4 Default Settings
      5. 8.5.5 Bus Overview
        1. 8.5.5.1 Serial Bus Address
        2. 8.5.5.2 Serial Interface
      6. 8.5.6 Writing to and Reading from the INA219
        1. 8.5.6.1 High-Speed I2C Mode
        2. 8.5.6.2 Power-Up Conditions
    6. 8.6 Register Maps
      1. 8.6.1 Register Information
      2. 8.6.2 Register Details
        1. 8.6.2.1 Configuration Register (address = 00h) [reset = 399Fh]
      3. 8.6.3 Data Output Registers
        1. 8.6.3.1 Shunt Voltage Register (address = 01h)
        2. 8.6.3.2 Bus Voltage Register (address = 02h)
        3. 8.6.3.3 Power Register (address = 03h) [reset = 00h]
        4. 8.6.3.4 Current Register (address = 04h) [reset = 00h]
      4. 8.6.4 Calibration Register
        1. 8.6.4.1 Calibration Register (address = 05h) [reset = 00h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Register Results for the Example Circuit
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.