SBOSAL5 June   2025 INA2227

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements (I2C)
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Integrated Analog-to-Digital Converter (ADC)
      2. 6.3.2 Internal Measurement and Calculation Engine
      3. 6.3.3 Low Bias Current
      4. 6.3.4 Low Voltage Supply and Wide Common-Mode Voltage Range
      5. 6.3.5 ALERT Pin
    4. 6.4 Device Functional Modes
      1. 6.4.1 Continuous Versus Triggered Operation
      2. 6.4.2 Device Low Power Modes
      3. 6.4.3 Power-On Reset
      4. 6.4.4 Averaging and Conversion Time Considerations
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
      2. 6.5.2 Writing to and Reading Through the I2C Serial Interface
      3. 6.5.3 High-Speed I2C Mode
      4. 6.5.4 General Call Reset
      5. 6.5.5 SMBus Alert Response
  8. 7 Register Maps
    1. 7.1 Device Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Measurement Range and Resolution
      2. 8.1.2 Current and Power Calculations
      3. 8.1.3 ADC Output Data Rate and Noise Performance
      4. 8.1.4 Filtering and Input Considerations
      5. 8.1.5 eFuse Current and Power Monitoring
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select the Shunt Resistor
        2. 8.2.2.2 Configure the Device
        3. 8.2.2.3 Program the Shunt Calibration Registers
        4. 8.2.2.4 Set Desired Fault Thresholds
        5. 8.2.2.5 Calculate Returned Values
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBJ|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1.5 eFuse Current and Power Monitoring

The additional bus pin of the INA2227 allows the device to be used in a low-side sensing configuration. This configuration allows power and current monitoring in eFuse applications without the need for an additional power current sense resistor. To monitor the eFuse current, the inputs of the INA2227 are connected to a resistor that is in series with the CS or IMON pin as shown in Figure 8-2.

INA2227 eFuse Application Circuit for Current and Power Monitoring Figure 8-2 eFuse Application Circuit for Current and Power Monitoring

The RSENSE resistor is sized so the full scale input range determined by the RANGE bit is not exceeded at the maximum eFuse IMON current. To allow adjustment of the IMON resistance and additional series resistor R1 is added above the RSENSE resistor. The VBUS pin must connect to either the input or output of the eFuse to monitor the power sourced from the power supply or power delivered to the load.

Because the current monitored by the INA2227 is a scaled-down version of the actual load current, the value for the RSHUNT used in Section 8.1.2 is calculated by multiplying the current monitor gain (GIMON) of the eFuse by the selected RSENSE resistor.

To take advantage of the full scale input range of the device, the value for the RSENSE resistor is larger than what is typically used in traditional current sense applications. The differential input impedance of the INA2227, RDIFF, results in some additional measurement error. The typical error induced is the result of the change in the RSENSE value with the parallel addition of the internal RDIFF impedance of 140kΩ. For example, an RSENSE value of 75Ω in parallel with the internal 140kΩ resistor results in an effective sense resistor of 74.96Ω which is 0.054% lower than the expected resistance. This additional error adds to the overall gain error of the device. For most applications, this error is negligible when compared to the tolerance of eFuse current gain.

To minimize noise and errors induced by ADC sampling with larger than typical RSENSE values, a 10nF capacitor must be added across at the inputs of the INA2227 when used in eFuse applications. This additional capacitor must be placed as close to the device input pins as possible.