SBOSAA0C november   2021  – may 2023 INA350

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Gain-Setting
        1. 8.3.1.1 Gain Error and Drift
      2. 8.3.2 Input Common-Mode Voltage Range
      3. 8.3.3 EMI Rejection
      4. 8.3.4 Typical Specifications and Distributions
      5. 8.3.5 Electrical Overstress
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Reference Pin
      2. 9.1.2 Input Bias Current Return Path
    2. 9.2 Typical Applications
      1. 9.2.1 Resistive-Bridge Pressure Sensor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 PSpice® for TI
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

GUID-20211020-CA0I-Q96T-VJFC-J9ZRPNSGWB4D-low.svgFigure 6-1 DDF Package,
8-Pin SOT-23
(Top View)
GUID-20211020-CA0I-JRLM-0FXG-ZRGTXNMWBFSW-low.svg
Note: Connect Thermal Pad to (V−)
Figure 6-2 DSG Package,
8-Pin WSON With Exposed Thermal Pad
(Top View)
Table 6-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
IN– 2 I Negative (inverting) input
IN+ 3 O Positive (non-inverting) input
OUT 6 — Output
REF 5 — Reference input. This pin must be driven by a low impedance source.
GS 1 I

Gain select – logic low (G = 10 for INA350ABS and G = 30 for INA350CDS)

Gain select – logic high (G = 20 for INA350ABS and G = 50 for INA350CDS)

Gain select – no connect (G = 20 for INA350ABS and G = 50 for INA350CDS)
SHDN 8 I

Shutdown – logic high (device enabled)

Shutdown – logic low (device disabled)

Shutdown – no connect (device enabled)
V– 4 — Negative supply
V+ 7 — Positive supply
(1) I = input, O = output
GUID-20211020-CA0I-LHF8-R5ZD-TQZBXRM8MRGM-low.svg Figure 6-3 RUG Package,
10-Pin X2QFN
(Top View)
Table 6-2 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
IN– 2 I Negative (inverting) input
IN+ 3 O Positive (noninverting) input
OUT 7 — Output
REF 6 — Reference input. This pin must be driven by a low impedance source.
GS 1 I

Gain select – logic low (G = 10 for INA350ABS and G = 30 for INA350CDS)

Gain select – logic high (G = 20 for INA350ABS and G = 50 for INA350CDS)

Gain select – no connect (G = 20 for INA350ABS and G = 50 for INA350CDS)
SHDN 9 I

Shutdown – logic high (device enabled)

Shutdown – logic low (device disabled)

Shutdown – no connect (device enabled)
V– 4 — Negative supply
V+ 8 — Positive supply
NC 5, 10 — No connect
(1) I = input, O = output