SLLSEB6E July   2012  – April 2019 ISO1540 , ISO1541

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions—ISO1540
    2.     Pin Functions—ISO1541
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Supply Current Characteristics
    11. 6.11 Timing Requirements
    12. 6.12 Switching Characteristics
    13. 6.13 Insulation Characteristics Curves
    14. 6.14 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
    4. 8.4 Isolator Functional Principle
      1. 8.4.1 Receive Direction (Left Diagram of )
      2. 8.4.2 Transmit Direction (Right Diagram of )
    5. 8.5 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 I2C Bus Overview
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

over recommended operating conditions, unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SIDE 1 (ONLY)
VILT1 Voltage input threshold low, SDA1 and SCL1 500 550 660 mV
VIHT1 Voltage input threshold high, SDA1 and SCL1 540 610 700 mV
VHYST1 Voltage input hysteresis VIHT1 –VILT1 40 60 mV
VOL1 Low-level output voltage, SDA1 and SCL1(1) 0.5 mA ≤ (ISDA1 and ISCL1) ≤ 3.5 mA 650 800 mV
ΔVOIT1 Low-level output voltage to high-level input voltage threshold difference, SDA1 and SCL1(1)(2) 0.5 mA ≤ (ISDA1 and ISCL1) ≤ 3.5 mA 50 mV
SIDE 2 (ONLY)
VILT2 Voltage input threshold low, SDA2 and SCL2 0.3 × VCC2 0.4 × VCC2 V
VIHT2 Voltage input threshold high, SDA2 and SCL2 0.4 × VCC2 0.5 × VCC2 V
VHYST2 Voltage input hysteresis VIHT2 – VILT2 0.05 × VCC2 V
VOL2 Low-level output voltage, SDA2 and SCL2 0.5 mA ≤ (ISDA2 and ISCL2) ≤ 35 mA 0.4 V
BOTH SIDES
|II| Input leakage currents, SDA1, SCL1, SDA2, and SCL2 VSDA1, VSCL1 = VCC1;
VSDA2, VSCL2 = VCC2
0.01 10 µA
CI Input capacitance to local ground, SDA1, SCL1, SDA2, and SCL2 VI = 0.4 × sin(2E6πt) + 2.5 V 7 pF
CMTI Common-mode transient immunity See Figure 21 25 50 kV/µs
VCCUV VCC undervoltage lockout threshold(3) 2.1 2.5 2.8 V
This parameter does not apply to the ISO1541 SCL1 line as it is unidirectional.
∆VOIT1 = VOL1 – VIHT1. This represents the minimum difference between a Low-Level Output Voltage and a High-Level Input Voltage Threshold to prevent a permanent latch condition that would otherwise exist with bidirectional communication.
Any VCC voltages, on either side, less than the minimum will ensure device lockout. Both VCC voltages greater than the maximum will prevent device lockout.