|IS||Safety input, output, or supply current||RθJA = 114.6°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 1||198||mA|
|RθJA = 114.6°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 1||303|
The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.