SLLSG12 August   2025 ISO6420 , ISO6421

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Safety-Related Certifications
    7. 6.7  Safety Limiting Values
    8. 6.8  Electrical Characteristics—5V Supply
    9. 6.9  Supply Current Characteristics—5V Supply
    10. 6.10 Electrical Characteristics—3.3V Supply
    11. 6.11 Supply Current Characteristics—3.3V Supply
    12. 6.12 Electrical Characteristics—2.5V Supply 
    13. 6.13 Supply Current Characteristics—2.5V Supply
    14. 6.14 Switching Characteristics—5V Supply
    15. 6.15 Switching Characteristics—3.3V Supply
    16. 6.16 Switching Characteristics—2.5V Supply
    17. 6.17 Insulation Characteristics Curves
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
    5. 8.5 Device I/O Schematics
      1. 8.5.1 Overvoltage Tolerant Input
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     54
    2.     55

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DWV|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.1 Electromagnetic Compatibility (EMC) Considerations

Many applications in harsh industrial environment are sensitive to disturbances such as electrostatic discharge (ESD), electrical fast transient (EFT), surge and electromagnetic emissions. These electromagnetic disturbances are defined and tested by international standards such as IEC 61000-4-x and CISPR 32. Although system-level performance and reliability depends, to a large extent, on the application board design and layout, the ISO642x family of devices incorporates many chip-level design techniques to help overall system robustness.