SLLSG12 August   2025 ISO6420 , ISO6421

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Safety-Related Certifications
    7. 6.7  Safety Limiting Values
    8. 6.8  Electrical Characteristics—5V Supply
    9. 6.9  Supply Current Characteristics—5V Supply
    10. 6.10 Electrical Characteristics—3.3V Supply
    11. 6.11 Supply Current Characteristics—3.3V Supply
    12. 6.12 Electrical Characteristics—2.5V Supply 
    13. 6.13 Supply Current Characteristics—2.5V Supply
    14. 6.14 Switching Characteristics—5V Supply
    15. 6.15 Switching Characteristics—3.3V Supply
    16. 6.16 Switching Characteristics—2.5V Supply
    17. 6.17 Insulation Characteristics Curves
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
    5. 8.5 Device I/O Schematics
      1. 8.5.1 Overvoltage Tolerant Input
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     54
    2.     55

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DWV|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) UNIT
PACKAGE PINS RθJA RθJC(top) RθJB ψJT ψJB RθJC(bot)
D (SOIC) 8 139.7 80.4 87.6 38.8 85.9 NA °C/W
DWV (Wide-SOIC) 8 128.1 65.4 86.9 40.9 84.4 NA °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.