SLLSFW9B April   2024  – January 2025 ISO7741TA-Q1 , ISO7741TB-Q1 , ISO7742TA-Q1 , ISO7742TB-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics Transformer
    10. 5.10 Electrical Characteristics—5V Supply
    11. 5.11 Supply Current Characteristics—5V Supply
    12. 5.12 Electrical Characteristics—3.3V Supply
    13. 5.13 Supply Current Characteristics—3.3V Supply
    14. 5.14 Electrical Characteristics—2.5V Supply 
    15. 5.15 Supply Current Characteristics—2.5V Supply
    16. 5.16 Switching Characteristics—5V Supply
    17. 5.17 Switching Characteristics—3.3V Supply
    18. 5.18 Switching Characteristics—2.5V Supply
    19. 5.19 Insulation Characteristics Curves
    20. 5.20 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 7.3.2 Push-Pull Converter
      3. 7.3.3 Core Magnetization
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
      2. 7.4.2 Start-Up Mode
      3. 7.4.3 Operating Mode
      4. 7.4.4 Spread Spectrum Clocking
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Drive Capability
        2. 8.2.2.2 LDO Selection
        3. 8.2.2.3 Diode Selection
        4. 8.2.2.4 Capacitor Selection
        5. 8.2.2.5 Transformer Selection
          1. 8.2.2.5.1 V-t Product Calculation
          2. 8.2.2.5.2 Turns Ratio Estimate
          3. 8.2.2.5.3 Recommended Transformers
      3. 8.2.3 Application Curve
        1. 8.2.3.1 Insulation Lifetime
      4. 8.2.4 System Examples
        1. 8.2.4.1 Higher Output Voltage Designs
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) ISO7741T-Q1 UNIT
DW (SOIC)
16 PINS
RθJA Junction-to-ambient thermal resistance 64.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 25.2 °C/W
RθJB Junction-to-board thermal resistance 33.3 °C/W
ψJT Junction-to-top characterization parameter 8.4 °C/W
ψJB Junction-to-board characterization parameter 32.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance NA °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.