SLLSFP4A July   2022  – August 2026 ISOW7721

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics - Power Converter
    10. 5.10 Supply Current Characteristics - Power Converter
    11. 5.11 Electrical Characteristics Channel Isolator - VIO, VISOIN = 5-V
    12. 5.12 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 5-V
    13. 5.13 Electrical Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
    14. 5.14 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
    15. 5.15 Electrical Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
    16. 5.16 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
    17. 5.17 Electrical Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
    18. 5.18 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
    19. 5.19 Switching Characteristics - 5-V Supply
    20. 5.20 Switching Characteristics - 3.3-V Supply
    21. 5.21 Switching Characteristics - 2.5-V Supply
    22. 5.22 Switching Characteristics - 1.8-V Supply
    23. 5.23 Insulation Characteristics Curves
    24. 5.24 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Power Isolation
      2. 7.1.2 Signal Isolation
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 7.3.2 Power-Up and Power-Down Behavior
      3. 7.3.3 Protection Features
      4. 7.3.4 Multi-Device Chaining for Increased Power Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
        1. 8.2.3.1 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Revision History
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

2 Applications

Device Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) BODY SIZE(NOM)

ISOW7721

ISOW7721F

 DFM (20) 12.83mm × 10.30mm 12.83mm × 7.50mm
(2) The package size (length × width) is a nominal value and includes pins, where applicable.