SLLSEY2F March   2017  – March 2019 ISOW7840 , ISOW7841 , ISOW7842 , ISOW7843 , ISOW7844

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Simplified Schematic
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—5-V Input, 5-V Output
    10. 7.10 Supply Current Characteristics—5-V Input, 5-V Output
    11. 7.11 Electrical Characteristics—5-V Input, 3.3-V Output
    12. 7.12 Supply Current Characteristics—5-V Input, 3.3-V Output
    13. 7.13 Electrical Characteristics—3.3-V Input, 3.3-V Output
    14. 7.14 Supply Current Characteristics—3.3-V Input, 3.3-V Output
    15. 7.15 Switching Characteristics—5-V Input, 5-V Output
    16. 7.16 Switching Characteristics—5-V Input, 3.3-V Output
    17. 7.17 Switching Characteristics—3.3-V Input, 3.3-V Output
    18. 7.18 Insulation Characteristics Curves
    19. 7.19 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 9.3.2 Power-Up and Power-Down Behavior
      3. 9.3.3 Current Limit, Thermal Overload Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
        1. 10.2.3.1 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Related Links
    4. 13.4 Receiving Notification of Documentation Updates
    5. 13.5 Community Resources
    6. 13.6 Trademarks
    7. 13.7 Electrostatic Discharge Caution
    8. 13.8 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • 100 Mbps data rate
  • Robust isolation barrier:
    • >100-Year projected lifetime at 1 kVRMS working voltage
    • Up to 5000 VRMS isolation rating
    • Up to 10 kVPK surge capability
    • ±100 kV/µs minimum CMTI
  • Integrated high-efficiency DC-DC converter with on-chip transformer
  • 3-V to 5.5-V Wide input supply range
  • Regulated 5-V or 3.3-V output
  • Up to 0.65-W output power
  • 5 V to 5 V; 5 V to 3.3 V: Available load current ≥ 130 mA
  • 3.3 V to 3.3 V: Available load current ≥ 75 mA
  • Soft-start to limit inrush current
  • Overload and short-circuit protection
  • Thermal shutdown
  • Default output: High and Low options
  • Low propagation delay: 13 ns Typ (5-V supply)
  • Robust electromagnetic compatibility (EMC)
    • System-level ESD, EFT, and surge immunity
    • ±8 kV IEC 61000-4-2 contact discharge protection across isolation barrier
    • Low emissions
  • 16-pin Wide SOIC package
  • Extended temperature range: –40°C to +125°C
  • Safety-related certifications:
    • 7071-VPK reinforced isolation per DIN V VDE V 0884-11:2017-01
    • 5000-VRMS isolation for 1 minute per UL 1577
    • CSA Certification per IEC 60950-1, IEC 62368-1 and IEC 60601-1 end equipment standards
    • CQC Approval per GB4943.1-2011
    • TUV Certification according to EN 60950-1 and EN 61010-1