High-efficiency, low-emissions, quad-channel, 1/3, reinforced digital isolator with integrated power
Product details
Parameters
Package | Pins | Size
Features
- 100 Mbps data rate
- Robust isolation barrier:
- >100-Year projected lifetime at 1 kVRMS working voltage
- Up to 5000 VRMS isolation rating
- Up to 10 kVPK surge capability
- ±100 kV/µs minimum CMTI
- Integrated high-efficiency DC-DC converter with on-chip transformer
- 3-V to 5.5-V Wide input supply range
- Regulated 5-V or 3.3-V output
- Up to 0.65-W output power
- 5 V to 5 V; 5 V to 3.3 V: Available load current ≥ 130 mA
- 3.3 V to 3.3 V: Available load current ≥ 75 mA
- Soft-start to limit inrush current
- Overload and short-circuit protection
- Thermal shutdown
- Default output: High and Low options
- Low propagation delay: 13 ns Typ (5-V supply)
- Robust electromagnetic compatibility (EMC)
- System-level ESD, EFT, and surge immunity
- ±8 kV IEC 61000-4-2 contact discharge protection across isolation barrier
- Low emissions
- 16-pin Wide SOIC package
- Extended temperature range: –40°C to +125°C
- Safety-related certifications:
- 7071-VPK reinforced isolation per DIN V VDE V 0884-11:2017-01
- 5000-VRMS isolation for 1 minute per UL 1577
- CSA Certification per IEC 60950-1, IEC 62368-1 and IEC 60601-1 end equipment standards
- CQC Approval per GB4943.1-2011
- TUV Certification according to EN 60950-1 and EN 61010-1
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Description
The ISOW784x is a family of high-performance, quad-channel reinforced digital isolators with an integrated high-efficiency power converter. The integrated DC-DC converter provides up to 650 mW of isolated power at high efficiency and can be configured for various input and output voltage configurations. Therefore these devices eliminate the need for a separate isolated power supply in space-constrained isolated designs.
The ISOW784x family of devices provides high electromagnetic immunity and low emissions while isolating CMOS or LVCMOS digital I/Os. The signal-isolation channel has a logic input and output buffer separated by a double capacitive silicon dioxide (SiO2) insulation barrier, whereas, power isolation uses on-chip transformers separated by thin film polymer as insulating material. Various configurations of forward and reverse channels are available. If the input signal is lost, the default output is high for the ISOW784x devices without the F suffix and low for the devices with the F suffix (see VSI and VSO can be either VCC or VISO depending on the channel direction).
These devices help prevent noise currents on data buses, such as RS-485, RS-232, and CAN, or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. Through innovative chip design and layout techniques, electromagnetic compatibility of the device has been significantly enhanced to ease system-level ESD, EFT, surge and emissions compliance. The high-efficiency of the power converter allows operation at a higher ambient temperature. The device is available in a 16-pin SOIC wide-body (SOIC-WB) DWE package.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The ISOW7841EVM is an evaluation module (EVM) used to evaluate the ISOW7841. The ISOW7841 is a high-performance, reinforced quad-channel digital isolator with integrated DC/DC converter in a wide-body SOIC package (package code, DWE). The EVM features enough test points and jumper (...)
Features
- High-speed, robust EMC quad-channel digital isolator with integrated power of 50% efficiency
- Wide supply & level translation range: 3 V to 5.5 V
- High signaling rate: Up to 100 Mbps
- Low propagation delay: 11 ns typical (5-V supplies)
- Isolation barrier life > 25 years
Design tools & simulation
Reference designs
Design files
-
download TIDA-00892 BOM.pdf (66KB) -
download TIDA-00892 Assembly Drawing.pdf (114KB) -
download TIDA-00892 PCB.pdf (496KB) -
download TIDA-00892 CAD Files.zip (334KB) -
download TIDA-00892 Gerber.zip (274KB)
Design files
-
download TIDA-01230 BOM.pdf (66KB) -
download TIDA-01230 Assembly Drawing.pdf (121KB) -
download TIDA-01230 PCB.pdf (448KB) -
download TIDA-01230 CAD Files.zip (291KB) -
download TIDA-01230 Gerber.zip (297KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
SOIC (DWE) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
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