SNOSCY0 March   2014 LDC1051

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Terminal Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Inductive Sensing
      2. 7.3.2 Measuring Rp with LDC1051
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
      2. 7.4.2 INTB terminal Modes
        1. 7.4.2.1 Comparator Mode
        2. 7.4.2.2 Wake-Up Mode
        3. 7.4.2.3 DRDYB Mode
    5. 7.5 Programming
      1. 7.5.1 SPI Description
        1. 7.5.1.1 Extended SPI Transactions
    6. 7.6 Register Map and Description
  8. 8 Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Calculation of Rp_MIN and Rp_MAX
        1. 8.1.1.1 Setting Rp_MAX
        2. 8.1.1.2 Setting Rp_MIN
      2. 8.1.2 Output Data Rate
      3. 8.1.3 Choosing Filter Capacitor (CFA and CFB Terminals)
    2. 8.2 Typical Applications
      1. 8.2.1 Axial Distance Sensing Using a PCB Sensor with LDC1051
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Sensor and Target
          2. 8.2.1.2.2 Calculating Sensor Capacitor
          3. 8.2.1.2.3 Choosing Filter Capacitor
          4. 8.2.1.2.4 Setting Rp_MIN and Rp_MAX
          5. 8.2.1.2.5 Calculating Minimum Sensor Frequency
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Lateral Position Sensing Application Diagram
      3. 8.2.3 Angular Position Sensing Application Diagram
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Remote Sensor Placement (Decoupling The LDC From Harsh Environments)
  • High Durability (By Virtue Of Contactless Operation)
  • Higher Flexibility For System Design (Using Coils Or Springs As Sensors)
  • Insensitive to Non-conductive Environmental Interferers (such As Dirt, Dust, Oil etc.)
  • Magnet-free Operation
  • Supply Voltage: 5 V, typ
  • Supply Voltage, IO: 1.8V to 5.5V
  • Stand-by Current: 250uA, typ
  • Rp Resolution: 8-bit
  • LC Frequency Range: 5kHz to 5MHz

2 Applications

  • Proximity Sensing
  • Level Sensing
  • Lateral Position Sensing

3 Description

Inductive sensing is a contactless, short-range sensing technology enabling high-resolution and low-cost position sensing of conductive targets, even in harsh environments. Using a coil or spring as a sensor, the LDC1051 inductance-to-digital converter provides system designers a way to achieve high performance and reliability at a lower system cost than other competing solutions.

The LDC1051 is pin compatible with the LDC1000 (16-bit Rp/24-bit L) and the LDC1041 (8-bit Rp/24-bit L). This family of devices offers system designers different resolution options based on their application and system requirements.

The LDC1051 is available in a 5mm x 4mm WSON-16 package. Device programming via SPI allows for easy configuration using a microcontroller.

Device Information

ORDER NUMBER PACKAGE BODY SIZE
LDC1051NHRT WSON (16) 5 mm × 4 mm
LDC1051NHRR WSON (16) 5 mm × 4 mm
LDC1051NHRJ WSON (16) 5 mm × 4 mm

Axial Distance Sensing Application

axial_distanse_measuring_nograph_snoscx2.png

Application Schematic

typ_app_snoscy0.gif

Rp vs Distance With 14mm PCB Coil

C002_snoscy1.png

4 Revision History

DATE REVISION NOTES
March 2014 * Initial release.