SNVS671F February   2011  – May 2019 LM21212-1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Application Circuit
  4. Revision History
  5. Description
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Performance Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Frequency Synchronization
      2. 8.3.2 Precision Enable
      3. 8.3.3 UVLO
      4. 8.3.4 Current Limit
      5. 8.3.5 Short-Circuit Protection
      6. 8.3.6 Thermal Protection
      7. 8.3.7 Power-Good Flag
      8. 8.3.8 Light Load Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Detailed Design Procedure
        1. 9.2.1.1 Custom Design With WEBENCH® Tools
        2. 9.2.1.2 Output Voltage
        3. 9.2.1.3 Precision Enable
        4. 9.2.1.4 Soft Start
        5. 9.2.1.5 Inductor Selection
        6. 9.2.1.6 Output Capacitor Selection
        7. 9.2.1.7 Input Capacitor Selection
        8. 9.2.1.8 Control Loop Compensation
      2. 9.2.2 Application Curves
  10. 10Layout
    1. 10.1 Pcb Layout Considerations
    2. 10.2 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With Webench® Tools
    2. 11.2 Receiving Notification Of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, And Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Protection

Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically at 165°C, the LM21212-1 tri-states the power FETs and resets soft start. After the junction cools to approximately 155°C, the device starts up using the normal start up routine. This feature is provided to prevent catastrophic failures from accidental device overheating. Note that thermal limit will not stop the die from operating above the specified maximum operating temperature,125°C. Keep the die under 125°C to ensure correct operation.