SNVS115E April   2000  – June 2019 LM2587

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Typical Applications
  3. 3 Description
    1.     Device Images
      1.      Flyback Regulator
  4. 4 Revision History
  5. 5 Pin Configurations
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESDRatings
    3. 6.3  Recommended Operating Ratings
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: 3.3 V
    6. 6.6  Electrical Characteristics: 5 V
    7. 6.7  Electrical Characteristics: 12 V
    8. 6.8  Electrical Characteristics: Adjustable
    9. 6.9  Electrical Characteristics: All Output Voltage Versions
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Step-Up (Boost) Regulator Operation
  8. 8 Application And Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Boost Regulator Applications
      2. 8.2.2 Typical Flyback Regulator Applications
        1. 8.2.2.1 Transformer Selection (T)
        2. 8.2.2.2 Transformer Footprints
          1. 8.2.2.2.0.1 T4
      3. 8.2.3 Design Requirements
      4. 8.2.4 Detailed Design Procedure
        1. 8.2.4.1 Custom Design With Webench® Tools
        2. 8.2.4.2 Programming Output Voltage (Selecting R1 And R2)
        3. 8.2.4.3 Short Circuit Condition
        4. 8.2.4.4 Flyback Regulator Input Capacitors
        5. 8.2.4.5 Switch Voltage Limits
        6. 8.2.4.6 Output Voltage Limitations
        7. 8.2.4.7 Noisy Input Line Condition)
        8. 8.2.4.8 Stability
    3. 8.3 Additional Application Examples
      1. 8.3.1 Test Circuits
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Heat Sink/Thermal Considerations
      1. 9.3.1 European Magnetic Vendor Contacts
      2. 9.3.2 Coilcraft
      3. 9.3.3 Pulse Engineering
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With Webench® Tools
    2. 10.2 Receiving Notification Of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)(2) LM2585 UNIT
KTT (DDPAK/TO-263 NDH (TO-220)
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 56(5) 65(3) °C/W
35(6) 45(4)
26(7) —
RθJC Junction-to-case thermal resistance 2 2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.
(2) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the LM2587 is used as shown in Figure 61 and Figure 62, system performance will be as specified by the system parameters.
(3) Junction-to-ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ½ inch leads in a socket, or on a PC board with minimum copper area.
(4) Junction-to-ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ½ inch leads soldered to a PC board containing approximately 4 square inches of (1oz.) copper area surrounding the leads.
(5) Junction-to-ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(6) Junction-to-ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(7) Junction-to-ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area reduces thermal resistance further. See the thermal model in Switchers Made Simple® software.