SNVS430I May   2006  – March 2015 LM26001 , LM26001-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings - LM26001
    3. 6.3 ESD Ratings - LM26001-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Sleep Mode
      2. 7.3.2 FPWM
      3. 7.3.3 Enable
      4. 7.3.4 Soft-Start
      5. 7.3.5 Current Limit
      6. 7.3.6 Frequency Adjustment and Synchronization
      7. 7.3.7 VBIAS
      8. 7.3.8 Low VIN Operation and UVLO
      9. 7.3.9 PGOOD
    4. 7.4 Device Functional Modes
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting Output Voltage
        2. 8.2.2.2 Inductor
        3. 8.2.2.3 Output Capacitor
        4. 8.2.2.4 Input Capacitor
        5. 8.2.2.5 Bootstrap
        6. 8.2.2.6 Catch Diode
        7. 8.2.2.7 Compensation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations and TSD
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from H Revision (November 2014) to I Revision

  • Update made to the Power Dissipation description in Section 6.1 Go
  • Changed ESD Ratings to ± and moved storage temp to Absolute Maximum RatingsGo

Changes from G Revision (April 2013) to H Revision

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from F Revision (April 2013) to G Revision

  • Changed layout of National Data Sheet to TI formatGo