SNVS334F January   2005  – January 2016 LM2734Z , LM2734Z-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Theory of Operation
      2. 7.3.2 Boost Function
      3. 7.3.3 Soft-Start
      4. 7.3.4 Output Overvoltage Protection
      5. 7.3.5 Undervoltage Lockout
      6. 7.3.6 Current Limit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Pin and Shutdown Mode
      2. 7.4.2 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 LM2734Z Design Example 1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Inductor Selection
          2. 8.2.1.2.2  Input Capacitor
          3. 8.2.1.2.3  Output Capacitor
          4. 8.2.1.2.4  Catch Diode
          5. 8.2.1.2.5  Boost Diode
          6. 8.2.1.2.6  Boost Capacitor
          7. 8.2.1.2.7  Output Voltage
          8. 8.2.1.2.8  Calculating Efficiency, and Junction Temperature
          9. 8.2.1.2.9  Calculating the LM2734Z Junction Temperature
          10. 8.2.1.2.10 WSON Package
          11. 8.2.1.2.11 Package Selection
        3. 8.2.1.3 Application Curve
      2. 8.2.2 LM2734Z Design Example 2
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 LM2734Z Design Example 3
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
      4. 8.2.4 LM2734Z Design Example 4
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
      5. 8.2.5 LM2734Z Design Example 5
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DDC Package
6-Pin SOT
Top View
LM2734Z LM2734Z-Q1 20130305.gif
NGG Package
6-Pin WSON
Top View
LM2734Z LM2734Z-Q1 20130360.gif

Pin Functions

PIN TYPE(1) DESCRIPTION
NAME SOT WSON
BOOST 1 3 I Boost voltage that drives the internal NMOS control switch. A bootstrap capacitor is connected between the BOOST and SW pins.
DAP — — P The die attach pad is internally connected to GND.
EN 4 6 I Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than VIN + 0.3 V.
FB 3 1 I Feedback pin. Connect FB to the external resistor divider to set output voltage.
GND 2 2 P Signal and Power ground pin. Place the bottom resistor of the feedback network as close as possible to this pin for accurate regulation.
SW 6 4 O Output switch. Connects to the inductor, catch diode, and bootstrap capacitor.
VIN 5 5 P Input supply voltage. Connect a bypass capacitor to this pin.
(1) I –Input, O – Output, P – Power