SNVS553C January   2008  – November 2016 LM3407

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Floating Buck Switching Converter
      2. 7.3.2 Pulse Level Modulation (PLM)
      3. 7.3.3 Internal VCC Regulator
      4. 7.3.4 Clock Generator
      5. 7.3.5 PWM Dimming of LED String
      6. 7.3.6 Input Under-Voltage Lock-Out (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low-Power Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Switching Frequency Selection
      2. 8.1.2 LED Current Setting
      3. 8.1.3 Input and Output Capacitors
      4. 8.1.4 Selection of Inductor
      5. 8.1.5 Free-Wheeling Diode
    2. 8.2 Typical Applications
      1. 8.2.1 LM3407 Design Example
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Calculate RISNS
          2. 8.2.1.2.2 Calculate RFS
          3. 8.2.1.2.3 Choose L
          4. 8.2.1.2.4 Choose CIN and CVCC
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Typical Application for Driving 6 LEDs
      3. 8.2.3 Typical Application for Driving 1 LED
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (May 2013) to C Revision

  • Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Changed RθJA for DGN package from 50°C/W to 55.6°C/WGo

Changes from A Revision (January 2009) to B Revision

  • Changed layout of National Semiconductor Data Sheet to TI format. Go