SNVS653E July   2011  – August 2015 LM3532

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C-Compatible Timing Specifications (SCL, SDA)
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 40-V Boost Converter
      2. 7.3.2 Hardware Enable Input
      3. 7.3.3 Feedback Enable
      4. 7.3.4 LM3532 Current Sink Configuration
      5. 7.3.5 PWM Inputs
      6. 7.3.6 Full-Scale LED Current
      7. 7.3.7 Interrupt Output
      8. 7.3.8 Protection Features
        1. 7.3.8.1 Overvoltage Protection
        2. 7.3.8.2 Current Limit
    4. 7.4 Device Functional Modes
      1. 7.4.1  LED Current Ramping
      2. 7.4.2  Start-up and Shutdown Current Ramping
      3. 7.4.3  Run-Time Ramp Rates
      4. 7.4.4  LED Current Mapping Modes
      5. 7.4.5  Exponential Current Mapping Mode
      6. 7.4.6  Linear Current Mapping
      7. 7.4.7  LED Current Control
        1. 7.4.7.1 I2C Current Control
        2. 7.4.7.2 I2C Current Control With PWM
      8. 7.4.8  Assigning and Enabling a PWM Input
      9. 7.4.9  Enabling a Current Sink
      10. 7.4.10 Ambient Light Sensor Current Control
        1. 7.4.10.1  ALS Resistors
        2. 7.4.10.2  Ambient Light Zone Boundaries
        3. 7.4.10.3  Ambient Light Zone Hysteresis
        4. 7.4.10.4  PWM Enabled for a Particular Zone
        5. 7.4.10.5  ALS Operation
        6. 7.4.10.6  ALS Input Select and ALS ADC Input
        7. 7.4.10.7  ALS ADC Readback
        8. 7.4.10.8  ALS Averaging
        9. 7.4.10.9  ALS ADC Average Readback
        10. 7.4.10.10 Initializing the ALS
        11. 7.4.10.11 ALS Operation
        12. 7.4.10.12 Direct ALS Control
      11. 7.4.11 Down Delay
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Start and Stop Conditions
        2. 7.5.1.2 I2C-Compatible Address
        3. 7.5.1.3 Transferring Data
    6. 7.6 Register Maps
      1. 7.6.1  Output Configuration
      2. 7.6.2  Start-up/Shutdown Ramp Rate
      3. 7.6.3  Run-Time Ramp Rate
      4. 7.6.4  Control A PWM
      5. 7.6.5  Control B PWM
      6. 7.6.6  Control C PWM
      7. 7.6.7  Control A Brightness Configuration
      8. 7.6.8  Control B Brightness Configuration
      9. 7.6.9  Control C Brightness Configuration
      10. 7.6.10 Control A, B, and C Full-Scale Current
      11. 7.6.11 Feedback Enable
      12. 7.6.12 Control Enable
      13. 7.6.13 ALS1 and ALS2 Resistor Select
      14. 7.6.14 ALS Down Delay
      15. 7.6.15 ALS Configuration
      16. 7.6.16 ALS Zone Readback / Information
      17. 7.6.17 ALS Zone Boundaries
      18. 7.6.18 Zone Target Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Capacitor Selection
        3. 8.2.2.3 Diode Selection
        4. 8.2.2.4 Maximum Output Power
          1. 8.2.2.4.1 Peak Current Limited
          2. 8.2.2.4.2 Output Voltage Limited
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Output Capacitor Placement
      2. 10.1.2 Schottky Diode Placement
      3. 10.1.3 Inductor Placement
      4. 10.1.4 Input Capacitor Selection and Placement
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

Application Note AN-1112: DSBGA Wafer Level Chip Scale Package (SNVA009).

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.