SNVS114G May   1999  – February 2015 LM3940

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Voltage Accuracy
      2. 7.3.2 Short-Circuit Protection
      3. 7.3.3 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with VIN = 5 V
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
          1. 8.2.2.1.1 Minimum Capacitance
          2. 8.2.2.1.2 ESR Limits
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Heatsinking
      1. 10.3.1 Heatsinking TO-220 Package Parts
      2. 10.3.2 Heatsinking DDPAK/TO-263 and SOT-223 Package Parts
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (November 2014) to G Revision

  • Changed pin names to TI nomenclatureGo
  • Deleted soldering information from Ab Max; this info is in POA Go
  • Changed Handling Ratings table to ESD Ratings table; move storage temp to Ab Max Go
  • Changed values in Input supply voltage row, ROC table Go
  • Changed IL to IOUT Go

Changes from E Revision (March 2013) to F Revision

  • Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section; update thermal valuesGo

Changes from D Revision (March 2013) to E Revision

  • Changed layout of National Data Sheet to TI formatGo