SNVS215D April   2003  – November 2015 LM5030

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High-Voltage Start-Up Regulator
      2. 7.3.2 Error Amplifier
      3. 7.3.3 PWM Comparator
      4. 7.3.4 Current Limit and Current Sense
      5. 7.3.5 Oscillator, Shutdown and Sync Capability
      6. 7.3.6 Slope Compensation
      7. 7.3.7 Soft Start and Shutdown
      8. 7.3.8 OUT1, OUT2, and Time Delay
      9. 7.3.9 Thermal Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 VCC
        2. 8.2.2.2 Current Sense
        3. 8.2.2.3 Shutdown
        4. 8.2.2.4 External Sync
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VIN to GND (Survival) –0.3 100 V
VCC to GND (Survival) –0.3 16 V
RT to GND (Survival) –0.3 5.5 V
All other pins to GND (Survival) –0.3 7 V
Power dissipation Internally Limited
Lead temperature  (soldering 4 seconds) 260 °C
Operating junction temperature 150 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Machine model (MM) ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN 14 90 V
TJ Operating junction temperature –40 105 °C

6.4 Thermal Information

THERMAL METRIC(1) LM5030 UNIT
DGS (VSSOP) DPR (WSON)
10 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 158.8 38.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 53.6 137.1 °C/W
RθJB Junction-to-board thermal resistance 74.8 15.2 °C/W
ψJT Junction-to-top characterization parameter 5.3 0.4 °C/W
ψJB Junction-to-board characterization parameter 77.6 15.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — 4.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Specifications are for TJ = 25°C. Unless otherwise specified: VIN = 48 V, VCC = 10 V, and RT = 26.7 kΩ
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
START-UP REGULATOR
VCCReg VCC Regulation Open ckt TJ = 25°C 7.7 V
full operating junction temperature range 7.4 8.0
VCC Current limit See Figure 2 TJ = 25°C 17 mA
full operating junction temperature range 10
I-VIN Start-up regulator leakage (external VCC supply) VIN = 90 V TJ = 25°C 150 µA
full operating junction temperature range 500
IIN Shutdown current SS = 0 V, VCC = open TJ = 25°C 250 µA
full operating junction temperature range 350
VCC SUPPLY
VCC Undervoltage lockout voltage TJ = 25°C VCCReg – 100 mV V
full operating junction temperature range VCCReg – 300 mV
Undervoltage hysteresis TJ = 25°C 1.6 V
full operating junction temperature range 1.2 2.1
ICC Supply current Cload = 0 TJ = 25°C 2 mA
full operating junction temperature range 3
ERROR AMPLIFIER
GBW Gain bandwidth 4 MHz
DC gain 75 dB
Input voltage VFB = COMP TJ = 25°C 1.245 V
full operating junction temperature range 1.220 1.270
COMP sink capability VFB = 1.5 V COMP = 1 V TJ = 25°C 13 mA
full operating junction temperature range 5
CURRENT LIMIT
CS1 Cycle-by-cyble CS threshold voltage TJ = 25°C 0.5 V
full operating junction temperature range 0.45 0.55
CS2 Restart CS threshold voltage Resets SS capacitor; auto restart TJ = 25°C 0.625 V
full operating junction temperature range 0.575 0.675
ILIM delay to output CS step from 0-V to 0.6-V time-to-onset of OUT transition (90%)
Cload = 0		 30 ns
CS sink current (clocked) CS = 0.3 V TJ = 25°C 6 mA
full operating junction temperature range 3
SOFT START AND SHUTDOWN
Softstart current source TJ = 25°C 10 µA
full operating junction temperature range 7 13
Softstart to COMP offset TJ = 25°C 0.5 V
full operating junction temperature range 0.25 0.75
Shutdown threshold TJ = 25°C 0.45 V
full operating junction temperature range 0.2 0.7
OSCILLATOR
Frequency1 (RT = 26.7K) TJ = 25°C 200 kHz
full operating junction temperature range 175 225
Frequency2 (RT = 8.2K) TJ = 25°C 600 kHz
full operating junction temperature range 510 690
Sync threshold TJ = 25°C 3.2 V
full operating junction temperature range 3.8
PWM COMPARATOR
Delay to output COMP set to 2-V CS stepped 0 to 0.4 V, time-to-onset of OUT transition low 30 ns
Max duty cycle Inferred from deadtime TJ = 25°C 49%
full operating junction temperature range 47.5% 50%
Min duty cycle COMP = 0 V full operating junction temperature range 0%
COMP to PWM comparator gain 0.34 V / V
COMP open circuit voltage VFB = 0 V TJ = 25°C 5.2 V
full operating junction temperature range 4.3 6.1
COMP short circuit current VFB = 0 V, COMP = 0 V TJ = 25°C 1.1 mA
full operating junction temperature range 0.6 1.5
SLOPE COMPENSATION
Slope comp amplitude Delta increase at PWM Comparator to CS TJ = 25°C 105 mV
full operating junction temperature range 80 130
OUTPUT SECTION
Deadtime Cload = 0, 10% to 10% TJ = 25°C 135 ns
full operating junction temperature range 85 185
Output high saturation Iout = 50 mA, VCC – VOUT TJ = 25°C 0.25 V
full operating junction temperature range 0.75
Output low saturation IOUT = 100 mA TJ = 25°C 0.25 V
full operating junction temperature range 0.75
Rise time Cload = 1 nF 16 ns
Fall time Cload = 1 nF 16 ns
THERMAL SHUTDOWN
Tsd Thermal shutdown temperature 165 °C
Thermal shutdown hysteresis 15 °C
(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC) methods. The limits are used to calculate TI's Average Outgoing Quality Level (AOQL).
(2) Typical numbers represent the most likely parametric norm for 25°C operation.

6.6 Typical Characteristics

at TJ = 25°C (unless otherwise noted)
LM5030 20058105.gif Figure 1. VCC vs VIN
LM5030 20058108.gif Figure 3. Oscillator Frequency vs RT
LM5030 20058110.gif Figure 5. Softstart Current vs Temperature
LM5030 20058115.png Figure 7. Feedback Amplifier Gainphase
LM5030 20058107.gif Figure 2. VCC vs ICC (VIN = 48 V)
LM5030 20058109.gif Figure 4. Oscillator Frequency vs Temperature RT = 26.7 kΩ
LM5030 20058111.gif Figure 6. Deadtime vs Temperature