SNVSC75 april   2023 LM5171-Q1

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Bias Supplies and Voltage Reference (VCC, VDD, and VREF)
      2. 7.3.2  Undervoltage Lockout (UVLO) and Controller Enable or Disable
      3. 7.3.3  High Voltage Inputs (HV1, HV2)
      4. 7.3.4  Current Sense Amplifier
      5. 7.3.5  Control Commands
        1. 7.3.5.1 Channel Enable Commands (EN1, EN2)
        2. 7.3.5.2 Direction Command (DIR1 and DIR2)
        3. 7.3.5.3 Channel Current Setting Commands (ISET1 and ISET2)
      6. 7.3.6  Channel Current Monitor (IMON1, IMON2)
        1. 7.3.6.1 Individual Channel Current Monitor
        2. 7.3.6.2 Multiphase Total Current Monitoring
      7. 7.3.7  Cycle-by-Cycle Peak Current Limit (IPK)
      8. 7.3.8  Inner Current Loop Error Amplifier
      9. 7.3.9  Outer Voltage Loop Error Amplifier
      10. 7.3.10 Soft Start, Diode Emulation, and Forced PWM Control (SS/DEM1 and SS/DEM2)
        1. 7.3.10.1 Soft-Start Control by the SS/DEM Pins
        2. 7.3.10.2 DEM Programming
        3. 7.3.10.3 FPWM Programming and Dynamic FPWM and DEM Change
        4. 7.3.10.4 SS Pin as the Restart Timer
      11. 7.3.11 Gate Drive Outputs, Dead Time Programming and Adaptive Dead Time (HO1, HO2, LO1, LO2, DT/SD)
      12. 7.3.12 Emergent Latched Shutdown (DT/SD)
      13. 7.3.13 PWM Comparator
      14. 7.3.14 Oscillator (OSC)
      15. 7.3.15 Synchronization to an External Clock (SYNCI, SYNCO)
      16. 7.3.16 Overvoltage Protection (OVP)
      17. 7.3.17 Multiphase Configurations (SYNCO, OPT)
        1. 7.3.17.1 Multiphase in Star Configuration
        2. 7.3.17.2 Daisy-Chain Configurations for 2, 3, or 4 Phases parallel operations
        3. 7.3.17.3 Daisy-Chain configuration for 6 or 8 phases parallel operation
      18. 7.3.18 Thermal Shutdown
    4. 7.4 Programming
      1. 7.4.1 Dynamic Dead Time Adjustment
      2. 7.4.2 UVLO Programming
    5. 7.5 I2C Serial Interface
      1. 7.5.1 REGFIELD Registers
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Small Signal Model
        1. 8.1.1.1 Current Loop Small Signal Model
        2. 8.1.1.2 Current Loop Compensation
        3. 8.1.1.3 Voltage Loop Small Signal Model
        4. 8.1.1.4 Voltage Loop Compensation
    2. 8.2 Typical Application
      1. 8.2.1 60-A, Dual-Phase, 48-V to 12-V Bidirectional Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Determining the Duty Cycle
          2. 8.2.1.2.2  Oscillator Programming
          3. 8.2.1.2.3  Power Inductor, RMS and Peak Currents
          4. 8.2.1.2.4  Current Sense (RCS)
          5. 8.2.1.2.5  Current Setting Limits (ISETx)
          6. 8.2.1.2.6  Peak Current Limit
          7. 8.2.1.2.7  Power MOSFETS
          8. 8.2.1.2.8  Bias Supply
          9. 8.2.1.2.9  Boot Strap
          10. 8.2.1.2.10 OVP
          11. 8.2.1.2.11 Dead Time
          12. 8.2.1.2.12 Channel Current Monitor (IMONx)
          13. 8.2.1.2.13 UVLO Pin Usage
          14. 8.2.1.2.14 HVx Pin Configuration
          15. 8.2.1.2.15 Loop Compensation
          16. 8.2.1.2.16 Soft Start
          17. 8.2.1.2.17 PWM to ISET Pins
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  9. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Direction Command (DIR1 and DIR2)

These pins are tri-state function pins. DIR1 controls CH-1, and DIR2 controls CH-2.

  1. When the DIR1 pin is actively pulled above 2 V (logic state of 1), CH-1 operates in buck mode, and current flows from the HV-Port to the LV-Port.
  2. When the DIR1 pin is actively pulled below 1 V (logic state of 0), CH-1 operates in boost mode, and current flows from the LV-Port to the HV-Port.
  3. When the DIR1 pin is in the third state that is different from the above two, it is considered an invalid command and CH-1 remains in standby mode regardless of the EN1 states. This tri-state function prevents faulty operation when losing the DIR signal connection to the MCU.
  4. When DIR1 changes the logic state between 1 and 0 dynamically during operation, the transition causes the SS/DEM1 pin to discharge first to below 0.3 V, then the SS/DEM1 pin pulldown is released and CH-1 goes through a new soft-start process to produce the current in the new direction. This eliminates the surge current during the direction change.
  5. Similar behaviors for DIR2, CH-2, EN2, and SS/DEM2.
  6. The built-in 10-µs glitch filter prevents errant operation by noise on the DIR1 and DIR2 signals.