SNVSCE8A July   2024  – November 2025 LM5190-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Wettable Flanks
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings 
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Input Voltage Range (VIN)
      2. 6.3.2  High-Voltage Bias Supply Regulator (VCC, BIAS)
      3. 6.3.3  Precision Enable (EN)
      4. 6.3.4  Power-Good Monitor (PGOOD)
      5. 6.3.5  Switching Frequency (RT)
      6. 6.3.6  Low Dropout Mode
      7. 6.3.7  Dual Random Spread Spectrum (DRSS)
      8. 6.3.8  Soft Start
      9. 6.3.9  Output Voltage Setpoint (FB)
      10. 6.3.10 Minimum Controllable On Time
      11. 6.3.11 Inductor Current Sense (ISNS+, VOUT)
      12. 6.3.12 Voltage Loop Error Amplifier
      13. 6.3.13 Current Monitor, Programmable Current Limit, and Current Loop Error Amplifier (IMON/ILIM, ISET)
      14. 6.3.14 Dual Loop Architecture
      15. 6.3.15 PWM Comparator
      16. 6.3.16 Slope Compensation
      17. 6.3.17 Hiccup Mode Current Limiting
      18. 6.3.18 High-Side and Low-Side Gate Drivers (HO, LO)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode
      2. 6.4.2 Forced PWM Mode and Synchronization (FPWM/SYNC)
      3. 6.4.3 Thermal Shutdown
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Power Train Components
        1. 7.1.1.1 Buck Inductor
        2. 7.1.1.2 Output Capacitors
        3. 7.1.1.3 Input Capacitors
        4. 7.1.1.4 Power MOSFETs
        5. 7.1.1.5 EMI Filter
      2. 7.1.2 Error Amplifier and Compensation
    2. 7.2 Typical Applications
      1. 7.2.1 High Efficiency 400kHz CC-CV Regulator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 7.2.1.2.2 Custom Design With Excel Quickstart Tool
          3. 7.2.1.2.3 Recommended Components
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Power Stage Layout
        2. 7.4.1.2 Gate-Drive Layout
        3. 7.4.1.3 PWM Controller Layout
        4. 7.4.1.4 Thermal Design and Layout
        5. 7.4.1.5 Ground Plane Design
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
        1. 8.2.1.1 PCB Layout Resources
        2. 8.2.1.2 Thermal Design Resources
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) LM5190-Q1 UNIT
RGY (VQFN)
19 PINS
RθJA Junction-to-ambient thermal resistance 44.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 40.1 °C/W
RθJB Junction-to-board thermal resistance 21.1 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 21.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.