SNVSBK9C November   2019  – September 2020 LM63635-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 System Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Sync/Mode Selection
      2. 8.3.2 Output Voltage Selection
      3. 8.3.3 Switching Frequency Selection
        1. 8.3.3.1 Spread Spectrum Option
      4. 8.3.4 Enable and Start-up
      5. 8.3.5 RESET Flag Output
      6. 8.3.6 Undervoltage Lockout and Thermal Shutdown and Output Discharge
    4. 8.4 Device Functional Modes
      1. 8.4.1 Overview
      2. 8.4.2 Light Load Operation
        1. 8.4.2.1 Sync/FPWM Operation
      3. 8.4.3 Dropout Operation
      4. 8.4.4 Minimum On-time Operation
      5. 8.4.5 Current Limit and Short-Circuit Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Choosing the Switching Frequency
        2. 9.2.2.2 Setting the Output Voltage
          1. 9.2.2.2.1 CFF Selection
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Output Capacitor Selection
        5. 9.2.2.5 Input Capacitor Selection
        6. 9.2.2.6 CBOOT
        7. 9.2.2.7 VCC
        8. 9.2.2.8 External UVLO
        9. 9.2.2.9 Maximum Ambient Temperature
      3. 9.2.3 Full Feature Design Example
      4. 9.2.4 Application Curves
      5. 9.2.5 EMI Performance Curves
    3. 9.3 What to Do and What Not to Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground and Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Glossary
    6. 12.6 Electrostatic Discharge Caution
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (April 2020) to Revision C (September 2020)

  • Updated the numbering format for tables, figures and cross-references throughout the document.Go
  • Update operating Vin max up to 36 V for WSON packageGo
  • Added Good EMI performance, Psuedo-random spread spectrum, and Compatible with CISPR 25 bulletsGo
  • Updated Section 7.3 Go

Changes from Revision A (January 2020) to Revision B (April 2020)

Changes from Revision * (November 2019) to Revision A (January 2020)

  • Changed device status from Advance Information to Production data Go