SNVSCM1 september   2023 LM70880-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Description (continued)
  7. 6Device and Documentation Support
    1. 6.1 Device Support
      1. 6.1.1 Development Support
    2. 6.2 Documentation Support
      1. 6.2.1 Related Documentation
        1. 6.2.1.1 PCB Layout Resources
        2. 6.2.1.2 Thermal Design Resources
    3. 6.3 Receiving Notification of Documentation Updates
    4. 6.4 Support Resources
    5. 6.5 Trademarks
    6. 6.6 Electrostatic Discharge Caution
    7. 6.7 Glossary
  8. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • RRX|29
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.