SNVSCM1
september 2023
LM70880-Q1
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Revision History
5
Description (continued)
6
Device and Documentation Support
6.1
Device Support
6.1.1
Development Support
6.2
Documentation Support
6.2.1
Related Documentation
6.2.1.1
PCB Layout Resources
6.2.1.2
Thermal Design Resources
6.3
Receiving Notification of Documentation Updates
6.4
Support Resources
6.5
Trademarks
6.6
Electrostatic Discharge Caution
6.7
Glossary
7
Mechanical, Packaging, and Orderable Information
7.1
Tape and Reel Information
Package Options
Mechanical Data (Package|Pins)
RRX|29
Thermal pad, mechanical data (Package|Pins)
Orderable Information
snvscm1_oa
6.2.1.2
Thermal Design Resources
Application notes:
Texas Instruments,
AN-2020 Thermal Design by Insight, Not Hindsight
AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
Texas Instruments,
Semiconductor and IC Package Thermal Metrics
Texas Instruments,
Thermal Design Made Simple with LM43603 and LM43602
Texas Instruments,
PowerPAD™
Thermally Enhanced Package
Texas Instruments,
PowerPAD Made Easy
Texas Instruments,
Using New Thermal Metrics