SLVSKK8 August   2026 LM7311

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO and UVP)
      2. 7.3.2 Overvoltage Lockout (OVLO)
      3. 7.3.3 Inrush Current, Overcurrent, and Short Circuit Protection
        1. 7.3.3.1 Slew Rate (dVdt) and Inrush Current Control
        2. 7.3.3.2 Short-Circuit Protection
        3. 7.3.3.3 Current Limit in Start-up
      4. 7.3.4 Analog Load Current Monitor
      5. 7.3.5 Reverse Current Protection
      6. 7.3.6 Overtemperature Protection (OTP)
      7. 7.3.7 Fault Response and Indication (FLT)
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Single Device, Self-Controlled
    3. 8.3 Typical Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
        1. 8.3.2.1 Setting Undervoltage Threshold
        2. 8.3.2.2 Setting Output Voltage Rise Time (tR)
        3. 8.3.2.3 Setting Analog Current Monitor Voltage (IMON) Range
        4. 8.3.2.4 39
      3. 8.3.3 Application Curves
    4. 8.4 Active ORing
    5. 8.5 Power Supply Recommendations
      1. 8.5.1 Transient Protection
      2. 8.5.2 Output Short-Circuit Measurements
    6. 8.6 Layout
      1. 8.6.1 Layout Guidelines
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Reference
    2. 11.2 Package Option Addendum
    3. 11.3 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Fault Response and Indication (FLT)

The following table summarizes the device response to various fault conditions.

Table 7-2 Fault Summary
Event Protection Response Fault Latched Internally FLT Pin Status Device Behaviour after Fault is removed

Overtemperature

Shutdown after TSD threshold

Y

L

Auto Retry(LM7311A)
Latch off (LM7311L)

Undervoltage (UVP or UVLO) on VIN or EN

Shutdown

N

H

Restart

Input Overvoltage

Shutdown after TOVP

Y

L

Latch off

Output Short-Circuit to GND

Circuit Breaker followed by Current Limit

N

H

Auto Retry.
Y after TSD L after TSD If TSD is hit during Current limit device behaviour is Auto retry (LM7311A) or Latch off (LM7311L) depending on the variant

Reverse Current ((VOUT - VIN) > VREVTH)

Reverse Current Blocking

N

H

Restart

Faults which are not latched internally are automatically cleared once the trigger condition goes away and thereafter the device recovers without any external intervention. Faults which are latched internally can be cleared either by power cycling the part (pulling VIN to 0 V and then above VUVP(R)) or by pulling the EN/UVLO pin voltage below VSD(F)