SNOSAW8F May   2008  – July 2026 LM7321 , LM7322

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Short Circuit Current and Dissipation Issues
    4. 6.4 Device Functional Modes
      1. 6.4.1 Driving Capacitive Loads
      2. 6.4.2 Electrical Overstress
      3. 6.4.3 Old Versus New Die Comparison
  8. 7 Application and Implementation
    1. 7.1 Typical Application
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Power Supply Recommendations
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4.3 Old Versus New Die Comparison

As of the publication of revision F of this datasheet, Texas Instruments has moved manufacturing of the die for LM732x to a modern fabrication site. The two different die are referred to in this document as “old” (previous fabrication site) and “new” die. The die origin can be separated from the “Chip Source Origin” (CSO) parameter in the shipping information. The old die CSO is “GF6”, for the new die CSO is “RFB”. The old die information is maintained in this datasheet for comparison purposes, but all new manufacturing has moved to the new die.