SNOS725E May   1999  – March 2025 LMC6462 , LMC6464

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for LMC6462
    5. 5.5 Thermal Information for LMC6464
    6. 5.6 Electrical Characteristics for VS = ±2.25V or VS = 5V
    7. 5.7 Electrical Characteristics for VS = ±1.5V or VS = 3V
  7. 6 Typical Characteristics
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input Common-Mode Voltage Range
      2. 7.1.2 Rail-to-Rail Output
      3. 7.1.3 Capacitive Load Tolerance
      4. 7.1.4 Compensating for Input Capacitance
      5. 7.1.5 Offset Voltage Adjustment
      6. 7.1.6 Instrumentation Circuits
    2. 7.2 Typical Applications
      1. 7.2.1 Transducer Interface Circuits
      2. 7.2.2 LMC646x as a Comparator
      3. 7.2.3 Half-Wave and Full-Wave Rectifiers
      4. 7.2.4 Precision Current Source
      5. 7.2.5 Oscillators
      6. 7.2.6 Low Frequency Null
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
        1. 7.3.1.1 PCB Layout for High-Impedance Work
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 PSpice® for TI
    2. 8.2 Documentation Support
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.6 Electrostatic Discharge Caution

LMC6462 LMC6464 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.