SNOS725E May   1999  – March 2025 LMC6462 , LMC6464

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for LMC6462
    5. 5.5 Thermal Information for LMC6464
    6. 5.6 Electrical Characteristics for VS = ±2.25V or VS = 5V
    7. 5.7 Electrical Characteristics for VS = ±1.5V or VS = 3V
  7. 6 Typical Characteristics
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input Common-Mode Voltage Range
      2. 7.1.2 Rail-to-Rail Output
      3. 7.1.3 Capacitive Load Tolerance
      4. 7.1.4 Compensating for Input Capacitance
      5. 7.1.5 Offset Voltage Adjustment
      6. 7.1.6 Instrumentation Circuits
    2. 7.2 Typical Applications
      1. 7.2.1 Transducer Interface Circuits
      2. 7.2.2 LMC646x as a Comparator
      3. 7.2.3 Half-Wave and Full-Wave Rectifiers
      4. 7.2.4 Precision Current Source
      5. 7.2.5 Oscillators
      6. 7.2.6 Low Frequency Null
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
        1. 7.3.1.1 PCB Layout for High-Impedance Work
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 PSpice® for TI
    2. 8.2 Documentation Support
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • N|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision D (March 2013) to Revision E (March 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated first page figureGo
  • Added Pin Configuration and Functions Go
  • Deleted note 2 from Absolute Maximum Ratings Go
  • Added ESD Ratings Go
  • Added Thermal Information Go
  • Updated parameter names and symbols in both Electrical Characteristics Go
  • Deleted notes 1, 2, and 3 from previous DC Electrical Characteristics Go
  • Deleted notes 1 and 2 from previous AC Electrical Characteristics Go
  • Moved note 4 conditions from previous DC Electrical Characteristics to open-loop gain test conditionsGo
  • Updated note 3 in previous AC Electrical Characteristics and moved conditions to slew rate test conditionsGo
  • Deleted phase margin from Electrical Characteristics Go
  • Moved note 3 conditions from previous AC Electrical Characteristics to crosstalk test conditionsGo
  • Changed short-circuit current (V+ = 15V, sinking) TYP from 75mA to 38mA and MIN from 55mA to 28mAGo
  • Changed short-circuit current (V+ = 15V, sinking, TJ = –40°C to +85°C) MIN from 45mA to 22mAGo
  • Added Figure 6-9 and Figure 6-10Go
  • Deleted Figures 12 to 15Go
  • Updated description in Input Common-Mode Voltage Range Go

Changes from Revision C (March 2013) to Revision D (March 2013)

  • Changed layout of National Data Sheet to TI formatGo