SNOS674I October   1997  – February 2024 LMC6482 , LMC6484

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information LMC6482
    5. 5.5 Thermal Information LMC6484
    6. 5.6 Electrical Characteristics: VS = 5V
    7. 5.7 Electrical Characteristics: VS = 3V
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Amplifier Topology
      2. 6.3.2 Input Common-Mode Voltage Range
      3. 6.3.3 Rail-to-Rail Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Upgrading Applications
      2. 7.1.2 Data Acquisition Systems
      3. 7.1.3 Instrumentation Circuits
    2. 7.2 Typical Applications
      1. 7.2.1 3V Single-Supply Buffer Circuit
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Capacitive Load Compensation
          2. 7.2.1.2.2 Capacitive Load Tolerance
          3. 7.2.1.2.3 Compensating For Input Capacitance
          4. 7.2.1.2.4 Offset Voltage Adjustment
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Typical Single-Supply Applications
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Spice Macromodel
        2. 8.1.1.2 PSpice® for TI
        3. 8.1.1.3 TINA-TI™ Simulation Software (Free Download)
        4. 8.1.1.4 DIP-Adapter-EVM
        5. 8.1.1.5 DIYAMP-EVM
        6. 8.1.1.6 TI Reference Designs
        7. 8.1.1.7 Filter Design Tool
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Differential input voltage ±Supply Voltage
Voltage at input/output pin (V–) – 0.3 (V+) + 0.3 V
VS Supply voltage, VS = (V+) – (V–) 16 V
Current at input pin(3) –5 5 mA
Current at output pin(4)(5) –30 30 mA
Current at power supply pin 40 mA
TJ Junction temperature(6) 150 °C
TSTG Storage temperature –65 150 °C
Lead temperature (soldering, 10 sec) 260 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) If military- or aerospace-specified devices are required, contact the TI Sales Office or Distributors for availability and specifications.
(3) Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings.
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result
in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30mA over a long term can adversely affect reliability.
(5) Do not short circuit output to V+, when V+ is greater than 13V or reliability is adversely affected.
(6) The maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max) − TA) / θJA. All numbers apply for packages soldered directly into a printed circuit board (PCB).