SNCS102G June   2005  – August 2018 LMH6572

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Truth Table
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 ±5V Electrical Characteristics
    6. 6.6 ±3.3V Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Single Supply Operation
      2. 7.2.2 Video Performance
      3. 7.2.3 Gain Accuracy
      4. 7.2.4 Expanding the Multiplexer
      5. 7.2.5 Other Applications
        1. 7.2.5.1 Driving Capacitive Loads
  8. 8 Power Supply Recommendations
    1. 8.1 Power Dissipation
    2. 8.2 ESD Protection
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Evaluation Boards
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Community Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.