SNOSA35G August   2002  – July 2015 LMH6657 , LMH6658

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics, 5 V
    6. 6.6 Electrical Characteristics, ±5 V
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Large Signal Behavior
    2. 7.2 Feature Description
    3. 7.3 Device Functional Modes
      1. 7.3.1 Output Phase Reversal
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Characteristics
        1. 8.1.1.1 Output Current Capability
        2. 8.1.1.2 Driving Capacitive Loads
        3. 8.1.1.3 Distortion
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

The LMH665x can operate off a single-supply or with dual supplies. The input CM capability of the parts (CMVR) extends all the way down to the V- rail to simplify single-supply applications. Supplies should be decoupled with low-inductance, often ceramic, capacitors to ground less than 0.5 inches from the device pins. TI recommends the use of ground plane, and as in most high-speed devices, it is advisable to remove ground plane close to device sensitive pins such as the inputs.