SNOSC84D August   2012  – February 2015 LMH6882

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
      1. 6.6.1 Single-Ended Input
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Digital Control of the Gain and Power-Down Pins
      2. 7.5.2 Parallel Interface
      3. 7.5.3 SPI-Compatible Serial Interface
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Characteristics
      2. 8.1.2 Output Characteristics
      3. 8.1.3 Interfacing to an ADC
        1. 8.1.3.1 ADC Noise Filter
        2. 8.1.3.2 AC Coupling to an ADC
        3. 8.1.3.3 DC Coupling to an ADC
      4. 8.1.4 Figure of Merit: Dynamic Range Figure
    2. 8.2 Typical Applications
      1. 8.2.1 LMH6882 Typical Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 LMH6882 Used as Twisted Pair Cable Driver
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Uncontrolled Impedance Traces
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NJK|36
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

    AN-2235 Circuit Board Design for LMH6517/21/22 and Other High-Speed IF/RF Feedback Amplifiers, SNOA869

11.2 Trademarks

SPI is a trademark of Motorola, Inc.

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.