SNAS760A April   2018  – January 2022 LMK00334-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Propagation Delay and Output Skew
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Differential Voltage Measurement Terminology
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Crystal Power Dissipation vs. RLIM
      2. 8.3.2 Clock Inputs
      3. 8.3.3 Clock Outputs
        1. 8.3.3.1 Reference Output
    4. 8.4 Device Functional Modes
      1. 8.4.1 VCC and VCCO Power Supplies
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Driving the Clock Inputs
        2. 9.2.1.2 Crystal Interface
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Termination and Use of Clock Drivers
        2. 9.2.2.2 Termination for DC-Coupled Differential Operation
        3. 9.2.2.3 Termination for AC-Coupled Differential Operation
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Current Consumption and Power Dissipation Calculations
      1. 10.1.1 Power Dissipation Example: Worst-Case Dissipation
    2. 10.2 Power Supply Bypassing
      1. 10.2.1 Power Supply Ripple Rejection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Management
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

For this device, consider the following guidelines:

  • For DC-coupled operation of an HCSL driver, terminate with 50 Ω to ground near the driver output as shown in Figure 11-1.
  • Keep the connections between the bypass capacitors and the power supply on the device as short as possible.
  • Ground the other side of the capacitor using a low impedance connection to the ground plane.
  • If the capacitors are mounted on the back side, 0402 components can be employed. However, soldering to the Thermal Dissipation Pad can be difficult.
  • For component side mounting, use 0201 body size capacitors to facilitate signal routing.