SNAS791C December   2019  – June 2021 LMK1C1102 , LMK1C1103 , LMK1C1104

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • High-performance 1:2, 1:3 or 1:4 LVCMOS clock buffer
  • Very low output skew < 50 ps
  • Extremely low additive jitter < 50 fs maximum
    • 7.5 fs typical at VDD = 3.3 V
    • 10 fs typical at VDD = 2.5 V
    • 19.2 fs typical at VDD = 1.8 V
  • Very low propagation delay < 3 ns
  • Synchronous output enable
  • Supply voltage: 3.3 V, 2.5 V, or 1.8 V
    • 3.3-V tolerant input at all supply voltages
  • fmax = 250 MHz for 3.3 V
    fmax = 200 MHz for 2.5 V and 1.8 V
  • Operating temperature range: –40°C to 125°C
  • Available in 8-pin TSSOP package
  • Available in 8-pin WSON package