SNVSAV8B June   2017  – August 2020 LMR23615

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency, Peak-Current-Mode Control
      2. 7.3.2  Adjustable Frequency
      3. 7.3.3  Adjustable Output Voltage
      4. 7.3.4  Enable/Sync
      5. 7.3.5  VCC, UVLO
      6. 7.3.6  Minimum ON-Time, Minimum-OFF Time, and Frequency Foldback at Dropout Conditions
      7. 7.3.7  Internal Compensation and CFF
      8. 7.3.8  Bootstrap Voltage (BOOT)
      9. 7.3.9  Overcurrent and Short-Circuit Protection
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 CCM Mode
      4. 7.4.4 Light Load Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Output Voltage Setpoint
        3. 8.2.2.3  Switching Frequency
        4. 8.2.2.4  Inductor Selection
        5. 8.2.2.5  Output Capacitor Selection
        6. 8.2.2.6  Feedforward Capacitor
        7. 8.2.2.7  Input Capacitor Selection
        8. 8.2.2.8  Bootstrap Capacitor Selection
        9. 8.2.2.9  VCC Capacitor Selection
        10. 8.2.2.10 Undervoltage Lockout Setpoint
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Compact Layout for EMI Reduction
      2. 10.1.2 Ground Plane and Thermal Considerations
      3. 10.1.3 Feedback Resistors
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

Limits apply over the recommended operating junction temperature (TJ) range of –40°C to +125°C, unless otherwise stated. Minimum and Maximum limits are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
POWER SUPPLY (VIN PIN)
VINOperation input voltage436V
VIN_UVLOUndervoltage lockout thresholdsRising threshold3.33.73.9V
Falling threshold2.93.33.5
ISHDNShutdown supply currentVEN = 0 V, VIN = 12 V, TJ = –40 °C to 125°C24μA
IQOperating quiescent current (non- switching)VIN =12 V, VFB = 1.2 V, TJ = –40 °C to 125°C, PFM mode75μA
ENABLE (EN/SYNC PIN)
VEN_HEnable rising threshold voltage1.41.551.7V
VEN_HYSEnable hysteresis voltage0.4V
VWAKEWake-up threshold0.4V
IENInput leakage current at EN pinVIN = 4 V to 36 V, VEN= 2 V10100nA
VIN = 4 V to 36 V, VEN= 36 V1μA
VOLTAGE REFERENCE (FB PIN)
VREFReference voltageVIN = 4 V to 36 V, TJ = 25 °C0.98511.015V
VIN = 4 V to 36 V, TJ = –40 °C to 125°C0.98011.020
ILKG_FBInput leakage current at FB pinVFB= 1 V10nA
INTERNAL LDO (VCC PIN)
VCCInternal LDO output voltage4.1V
VCC_UVLOVCC undervoltage lockout thresholdsRising threshold2.83.23.6V
Falling threshold2.42.83.2
CURRENT LIMIT
IHS_LIMITPeak inductor current limit2.93.94.9A
ILS_LIMITValley inductor current limit1.92.53.2A
IL_ZCZero cross current limit–0.04A
INTEGRATED MOSFETS
RDS_ON_HSHigh-side MOSFET ON-resistanceVIN = 12 V, IOUT = 1 A160mΩ
RDS_ON_LSLow-side MOSFET ON-resistanceVIN = 12 V, IOUT = 1 A95mΩ
THERMAL SHUTDOWN
TSHDNThermal shutdown threshold162170178°C
THYSHysteresis15°C