SNVSBE0F October   2020  – January 2024 LMR43610-Q1 , LMR43620-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Enable, Start-Up, and Shutdown
      2. 7.3.2  External CLK SYNC (with MODE/SYNC)
        1. 7.3.2.1 Pulse-Dependent MODE/SYNC Pin Control
      3. 7.3.3  Adjustable Switching Frequency (with RT)
      4. 7.3.4  Power-Good Output Operation
      5. 7.3.5  Internal LDO, VCC, and VOUT/FB Input
      6. 7.3.6  Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
      7. 7.3.7  Output Voltage Selection
      8. 7.3.8  Spread Spectrum
      9. 7.3.9  Soft Start and Recovery from Dropout
        1. 7.3.9.1 Recovery from Dropout
      10. 7.3.10 Current Limit and Short Circuit
      11. 7.3.11 Thermal Shutdown
      12. 7.3.12 Input Supply Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 CCM Mode
        2. 7.4.3.2 Auto Mode – Light-Load Operation
          1. 7.4.3.2.1 Diode Emulation
          2. 7.4.3.2.2 Frequency Reduction
        3. 7.4.3.3 FPWM Mode – Light-Load Operation
        4. 7.4.3.4 Minimum On-Time (High Input Voltage) Operation
        5. 7.4.3.5 Dropout
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Choosing the Switching Frequency
        2. 8.2.2.2  Setting the Output Voltage
          1. 8.2.2.2.1 FB for Adjustable Output
        3. 8.2.2.3  Inductor Selection
        4. 8.2.2.4  Output Capacitor Selection
        5. 8.2.2.5  Input Capacitor Selection
        6. 8.2.2.6  CBOOT
        7. 8.2.2.7  VCC
        8. 8.2.2.8  CFF Selection
        9. 8.2.2.9  External UVLO
        10. 8.2.2.10 Maximum Ambient Temperature
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision E (June 2022) to Revision F (January 2024)

  • Added Automotive to the title of the document. Go
  • Updated the Device Information table to include different rated load currents for each GPN.Go
  • Added LMR43620MC5RPERQ1 to Device Comparison Table Go
  • Deleted color from Figure 5-1 and spacing between unit and value in Table 5-1. Go
  • Removed color from the Functional Block Diagram per TI Standards. Go
  • Deleted color from Auto/FPWM mode transition figures per TI Standards. Go
  • Deleted color from RT vs. Frequency figure per TI Standards. Go
  • Deleted color from Figure 8-1 per TI Standards. Go
  • Deleted color from Figure 8-29 per TI Standard.Go

Changes from Revision D (March 2022) to Revision E (June 2022)

Changes from Revision C (December 2021) to Revision D (March 2022)

  • Added functional safety bullet in the Features section.Go
  • Changed title to reflect less than 2.5μA IQ. Go
  • Updated efficiency graph on front page, and replaced mention of pseudorandom spread spectrum with dual random spread spectrum. Go
  • Updated Section 4 and included links to Device Nomenclature legend.Go
  • Updated BOOT nomenclature in Absolute Maximum Ratings.Go
  • Combined Electrical Characteristics table, Timing, and Switching characteristics tables. Included 5-V fixed output device information and included 1-A device current limit specifications. Added spread spectrum specificationGo
  • Updated BOOT nomenclature in the Electrical Characteristics table.Go
  • Changed pseudorandom to dual random spread spectrum.Go
  • Updated enable behavior and start-up images as well as VEN-WAKE from 0.4 V to 0.5 V.Go
  • Corrected PGOOD nomenclature.Go
  • Corrected VCC rail voltage and clarified informationGo
  • Updated BOOT nomenclature.Go
  • Corrected type of spread spectrum used by device.Go
  • Corrected current limit nomenclature.Go
  • Corrected information in Section 7.3.12 Go
  • Corrected the enable wake-up threshold voltage from 0.4 V to 0.7 V.Go
  • Removed information regarding VCC UVLO levels to remain consistent with information provided in the Electrical Characterisitcs. Go
  • Updated the nomenclature of the minimum input voltage from VIN_R to VINMIN to align with the Electrical Characteristics. Go
  • Changed IPEAK-MIN to IPEAKMIN to align with Electrical Characteristics nomenclature.Go
  • Changed FB to VOUT/FB to align with pin nomenclature.Go
  • Updated Figure 8-1 to reflect RT pin. Go
  • Changed 'pin 8' to 'VOUT/FB' in Setting the Output Voltage Go
  • Changed ILIMIT and ISC to IVALMAX Go
  • Included maximum CFF limit.Go
  • Added 5V fixed in Section 8.2.3 Go
  • Included Section 9.1.2 Go